"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The ERSASCOPE systems provide unique, optical inspection of solder joints. The patented systems ideally complement x-ray inspection of BGAs! Find our products ? https://www.kurtzersa.com/electronics-production-equipment/rework-inspection-systems/insp
The 2800 series of Huntron® Tracker® are designed to complement conventional test instruments in the debug and troubleshooting process. Using the proven power-off test method known as Tracker Signature Analysis it eliminates the risk of further circu
The X-Spection 6000 is our most Technologically Advanced X-Ray Inspection System. As with all X-SCOPE platforms, it includes every advanced s/w tool required for a wide variety of applications. With more tilt and a rotating work table, the X-Spection
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
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