New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Used SMT Equipment | Soldering - Reflow
BTU Paragon 150 Reflow Oven Approx. Dimensions: 256" x 60" x 72" Item Location: Laval, QC Canada Features: Left to Right Edge Rail Mesh Belt
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2023-08-12 13:48:10.0
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main methods to improve the speed of the SMT machine:
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Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
In the SMT production process, considering the importance of the mounting speed of the SMT machine, many SMT machine manufacturers are making every effort to improve the speed of the SMT machine. KINGSUN technical team has analyzed the following main
03047697-01 Machine controller MicroBox 420 V2 03047752-02 Inrush-current limiter 03047765-01 Transport Lock long asymmetrical compl 03047768S01 12-segm. C+P head DLM3 / w.out sleeves 03047822-01 VACUUM NOZZLE VADM-200 03047845-01
Career Center | Huntsville, Alabama USA | Engineering,Production
Location: Kansas Description: Process engineer to support manufacturing in PCB assembly facility. Requirements: Need at least three years hands on experience designing and improving manufacturing processes including screen printing, placement, r
Career Center | Huntsville, Alabama USA | Engineering,Management,Production
Location: Southeastern U.S. Description: Director of Manufacturing Engineering will be responsible for company-wide NPI. Requirements: Need at least five years PCB assembly experience and three years Manufacturing Engineering Management. Please
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
Career Center | Huntsville, Alabama USA | Engineering,Management,Production,Research and Development,Technical Support
JOHN E. MASLOWSKI 1935 Meadowbrook Drive #1101 Huntsville, Alabama 35803 256-882-3787 E-Mail: johnm2@hiwaay.net CAREER OBJECTIVE A responsible job in the area of Manufacturing Management, Production Control, or Technical Coordination with a firm
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