Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Industry Directory | Manufacturer
ALT Dynachem provide the industry with advanced equipments for dry film lamination, both automatic cut sheet laminators and vacuum laminators.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Services
PCB Repair Services BEST is your experienced resource for high value added PCB repair services. If you need any of the following completed to your printed circuit board then let the experts at BEST be your answer: Pad repair services Pad replace
Used SMT Equipment | Pick and Place/Feeders
Performance One-Side Operation The single-cantilever, single-rail structure optimizes the production area and manpower efficiency of equipment that uses only one side of the machine Flexible Production Capable of handling long substrates up to 1,50
Used SMT Equipment | Pick and Place/Feeders
The parameters of the Star CP40LV patch machine Samsung CP40LV parameter Samsung CP40LV mount speed: 8000 CPH / H(IPC9850) servo system: servo motor drive X, Y axis-Z axis mobile drive system mount head: 3 mount heads, With fixed camera CP40LV Samsun
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This video presents the capabilities of BEST Inc in terms of its ability to perform high end PCB rework and repair services. BEST Inc., located in Rolling Meadows IL is a company of soldering "geeks". We rework/repair PCBs, train and certify solderin
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Tue Jul 12 18:30:00 UTC 2022 - Tue Jul 12 18:30:00 UTC 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Career Center | Conklin, New York USA | Engineering,Production,Technical Support
Over 14 years experience in the PCB manufacturing field. Very successful in completing some projects. Computer courses in: Power Point, Excel, Word, Project
Career Center | Tempe, Arizona USA | Engineering,Production
Extensive experience in the fabrication of printed circuit boards, thick film hybrids, electroluminescent phosphor and lamps, electrolytic tilt sensors. Process control in photoimaging, etching, plating, lamination, screen printing, solder mask, etc
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
| https://www.eptac.com/webinars/interpreting-ipc-a-600-requirements-for-annular-rings-and-laminate-cracks/
Interpreting IPC-A-600 Requirements for Annular Rings and Laminate Cracks - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/4570.html
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