Industry Directory | Consultant / Service Provider / Manufacturer
Specializing in electronic circuit board assembly services. Various capabilities include engineering, assembly, designing, prototyping,supply chain management, testing, documentation, rework, repair and soldering. On-time delivery
Industry Directory | Consultant / Service Provider / Manufacturer
Trusted EMS Manufacturer, ISO9001, ISO14001, UL, RoHS, REACH Cheap PCB Assembly, No MOQ, Min Device 01005 HDI PCB from 4-20 Layers, Anylayer Build-up, BGA 0.25mm Quickturn Delivery Supported by 3 Plants
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Fabrication Services
Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads
Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
Electronics Forum | Thu Feb 08 14:03:39 EST 2007 | dave
Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25 mm difference in height on one edge of the BGA to the other. It is notable under magnification. Is this caused by to much time above reflow temp or not
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100 yamaha economical chipmounter Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHAYV100A Substrate size: ATS20 (end to put) W - ATassembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thickness: 0.4
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2011-04-06 14:07:24.0
Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.
Parts & Supplies | Pick and Place/Feeders
Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
Yamaha S10 SMD Placement 3D Hybrid Modular SMT Mounter ❙ Features of Yamaha SMD Placement ETA Providing new compact economy flexible modular Yamaha SMD placement, Yamaha SMT mounter for laptop production line. We provide overseas services, te
| https://www.smtfactory.com/I-C-T-V5000H-SMT-On-line-Automated-Optical-Inspection-AOI-Machine-for-SMT-Line-pd49400944.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
