Industry Directory | Manufacturer
pcb construction@testing using surface mount and through hole components.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Wed Mar 17 14:59:53 EST 2004 | Claude_Couture
since there is a bit of humor in this thread, try drilling the pads from the opposite side of the pcb.
Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Used SMT Equipment | Flexible Mounters
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Used SMT Equipment | SMT Equipment
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S51
Parts & Supplies | Pick and Place/Feeders
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S5135A SWITCH PHOTO F
Technical Library | 2007-02-01 10:08:40.0
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair
BGA Pad Repair – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling
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