The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Mon Feb 23 16:36:21 EST 2004 | www.smtinfo.net
Alpha Metals sells a paste developed especially for 0201's and 0.5 mm pitch BGA's. I have no idea if if does what it promises, but it might be worth to give it a try. See http://www.alphametals.com/omnixsolder/pdfs/OM_6106.PDF
Electronics Forum | Fri Feb 20 13:25:00 EST 2004 | russ
Help! i just rec'd my next job from our marketing people and it has a .5mm pitch BGA 8mmX8mm size. Along with this kit came the stencil. So, I have never placed this fine of a BGA before and I am pretty worried about the stencil releasing the past
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
Used SMT Equipment | Flexible Mounters
Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
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Parts & Supplies | AOI / Automated Optical Inspection
Universal AI part Scissor Knife Set 43871702 44241906 ARM,KICKOUT 5MM,RH 44241908 ARM,KICKOUT STD RH N 44241909 ARM,KICKOUT 5MM RH N 44241910 REPLACED BY: 44241909 44241911 ARM,KICKOUT 5MM RH N 44241912 ARM,KICKOUT STD RH N 44241913 ARM,
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Parts & Supplies | AOI / Automated Optical Inspection
Universal plug-in machine guide wheel 18164000 44241906 ARM,KICKOUT 5MM,RH 44241908 ARM,KICKOUT STD RH N 44241909 ARM,KICKOUT 5MM RH N 44241910 REPLACED BY: 44241909 44241911 ARM,KICKOUT 5MM RH N 44241912 ARM,KICKOUT STD RH N 44241913 AR
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Technical Library | 2016-05-30 22:24:00.0
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.
SMT Barcode Inkjet Printer ETA-410 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt barcode Inkjet Printing Machine,pcb barcode printing
ETA SMT PCB Laser Marking Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB Laser Marking Machine,PCB Laser Marking System,PCB Aut
to ground. Usually, small isolated areas < 2.5.mm s
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/bga-pad-size_topic3004.html
. I am currently working on a BGA footprint with .26mm nominal ball size and .5mm pitch. Is my understand correct that when ball pitch is
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-nozzle-for-the-srt-bga-rework-station-13-5mm-x-33mm
BGA Rework Nozzle for the SRT BGA Rework Station 13.5mm X 33mm – Precision PCB Services, Inc. Search Log in or Create account Cart
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