Industry Directory | Distributor
Distributor of hot-sales and hard-to-find electronic and electromechanical components and supplies. Online catalogue, data sheets and purchasing. win-source.net
Industry Directory | Manufacturer
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Electronics Forum | Thu Feb 28 08:22:21 EST 2002 | caldon
DITTO...
Electronics Forum | Fri Mar 03 15:51:17 EST 2006 | TM
Sorry I meant CP60 Series
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2020-05-27 15:54:35.0
Blackfox is opening its facilities to in-person training for the electronics manufacturing industry with a thorough and documented safety plan for all. If preferred, Blackfox is also offering online IPC training and certification in either English or Spanish from the comfort of your home or office.
Juki 2070~FX3 laser LNC60 P/N:40045547
Juki 2070~FX3 laser LNC60 P/N:40045547 jenny@ksunsmt.com
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,
Screen Printing Key Factors
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | Bedford, Texas USA | Technical Support
Field Engineer for Salt Lake City. Candidate should have 3+ years SMT, PCBA equipment knowledge and be able to travel 60% in the region with a focus on a SL customer. Candidate will be fixing, repairing, programming, installing, etc SMT machines in
Career Center | Bedford, Texas USA | Engineering
Field Engineer for Phoenix, AZ. Need a top notch SMT/PCBA equipment person to travel regionally in SW to fix, repauir, improve processes, program, install SMT/ PCBA capital lines. Work for a major provider /OEM, travel up to 60& , income up to 60K
Career Center | , | 2013-01-25 05:38:51.0
PLC programmer , PIC micro controller . have a basic knowledge of C C++ & assembly language.
Career Center | , | 2013-01-25 05:39:14.0
PLC programmer , PIC micro controller . have a basic knowledge of C C++ & assembly language.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-jp/products/adhesive-dispensing-systems-products/eb-60-flex-edge-banding-slot-applicator
EB 60フレックス エッジバンディング スロットアプリケーター Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click Icon Close Close Icon Open
Lewis & Clark | http://www.lewis-clark.com/product-tag/gc-60/
GC-60 Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
