Industry Directory | Equipment Dealer / Broker / Auctions
We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
Used SMT Equipment | Pick and Place/Feeders
The machine includes the following: 3 Banks of 10 lines for 8mm 2 Bank of 4 lines for 8 mm 1- 12 mm 1 – 16 mm 1- 24 mm 1 Bank of 7 lines for 12 mm This gives a total of 38- 8mm, 9 – 12mm, 2 – 16mm and 2 – 24mm Also has a Tube feeder and a Tra
Used SMT Equipment | Pick and Place/Feeders
SMT Feeder Cart & Feeders This lot contains the following Items: (1) Siemens Feeder Cart with wheels (1) Hover Davis [3x8mm] (1) Hover Davis [12/16mm] (6) Siemens [2x8mm] (3) Siemens [12/16mm] (4) Siemens [24/32mm] (1) Siemens [44mm] Dimensi
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
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