Industry Directory | Manufacturer
Supplier of High-Tech Low-Cost Printed Circuit Boards with 1-48 layers from 24h express. Flex, flex-rigid, metal core, impedance control, blind & buried vias as well as SMD Stencils.
Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
New Equipment | Assembly Services
Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Ink Rigid-Flex Board | Application Consumer Electronics
New Equipment | Fabrication Services
6 Layer Rigid-Flex PCB Material: FR-4(KB)+Polyimide(DuPont) No of layer: 6 Layer Board thickness: 1.6mm Copper thickness: 35um/1oz Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Solder mask: Matt Green Other technology: FR-4 Stiffner
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
Electronics Forum | Mon Dec 29 08:54:46 EST 2003 | pjc
SPM is superior. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the UltraPrint 100. UP100 is microprocessor controlled while the SPM has a PC. The SPM cameras can be positioned more rapidly and with greater accuracy than UP100's.
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments 4982A Advantis AX-72 Multifunction Placement Machine with DPTF -DPTF Direct Pick Tray Feeder 4557D (fits in right rear feeder slot that is not installed in photos) -UPS+ 6.7.0.1 Software (8.2 Compatible) with Windows Operatin
Industry News | 2013-09-10 14:07:38.0
IPC announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and order growth both continued trending upward.
Industry News | 2022-12-26 11:33:10.0
IPC releases PCB industry results for November 2022
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000685 X MOTOR ASSY(AC600W) 40000727 Y MOTOR ASSY(AC1140W) 40000851 MOTOR PULLEY B 40000870 MOTOR_PULLEY_C 40000872 MOTOR PULLEY S 40000927 BU_MOTOR_ASM 40001009 MOTOR BRAKET
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
The LIRM is a dual workstation inline laser singulation machine specially designed to handle FR4 / FR2 and flex PCBA's up to 1.6mm in thickness. It comes in 2 versions which handles different panel sizes. The system employs a green laser source
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
SMTnet Express, January 19, 2017, Subscribers: 30,111, Companies: 15,096, Users: 41,767 Rigid-Flex PCB Right the First Time - Without Paper Dolls Benjamin Jordan; Altium The biggest problem with designing rigid-flex hybrid PCBs is making sure
Recommendations for Installing Flash LEDs on Flex Circuits Recommendations for Installing Flash LEDs on Flex Circuits For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly
Heller Industries Inc. | https://hellerindustries.com/product/1505-mark-v-series-smt-reflow-oven/
:50-610 mm Maximum conveyor speed: 188 cm/min Temperature range: 60-350 °C Accuracy of Temperature Controller: ±0,1 °C Typical power consumptions
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6010.html
Cable RS-232 03089445-02 Grounding plate for short circuit test 03089506-01 X- read head mounting bracket 03089515-01 llk asp speed flex complete 03089582S01 Support pin compl. / SPS 03089614S02 Board control / SPS 03089675-01 Pull spring - reduced eye
