Industry Directory | Manufacturer
WE WOULD LIKE TO INTRODUCE OUR SELVES AS ONE OF THE OLDEST, PIONEERS AND SPECIALIST IN MANUFACTURE OF “ AIM BRAND” THREAD AND PLAIN GAUGES.
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
PCB Depaneling, CWVC-450 Specification: Max Cutting Length 480mm PCB Thickness 0.6-3.5mm PCB Material FR1, FR4, CEM1, CEM3, MCPCB Cutting Stress Less than 500 Machine Weight 280kgs
Sepcifications for pcb separator machine CWVC-450J: Model CWVC-450J The Longest Minimize 450mm Size 960×425×350mm Minimize thickness 1.0-3.
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Parts & Supplies | Chipshooters / Chip Mounters
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the machines with very good competitive
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Technical Library | 2010-03-30 21:51:23.0
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
03009853-01 CENTERING PIN ROUND 03009896-01 assembly Y-cushion left X-4 03009903-01 assembly Y-cushion right X-4 03009924-02 Videomultiplexer 03009940-03 Upper Frame compl. 03009963S03 slide-in framework 03009966-01 furnished material 0300997
03010187S01 PE-UHMW FOIL 42,5 x 0,5 mm x 40m/Rol 03010315S01 Maglev MWA120-0064 03010326S01 PE-UHMW GLUE TAPE 50 x 0,3mm x 16,5m 03010329S01 HOLDER FEEDER SLIDE SPRING/X8 03010352-01 Tension spring d=0,63* D=5,6* Lo=23,3 03010415
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