Industry Directory | Manufacturer
WE WOULD LIKE TO INTRODUCE OUR SELVES AS ONE OF THE OLDEST, PIONEERS AND SPECIALIST IN MANUFACTURE OF “ AIM BRAND” THREAD AND PLAIN GAUGES.
Industry Directory | Manufacturer
A printed circuit board manufacturer producing high quality prototype printed circuit boards.
Incorporating a cable lock option, the 62674 series of 0.5mm pitch vertical connectors from FCI provides a high cable retention force for flexible printed circuits. Preheld by the connector's compact slider mechanism, cables are easily mated in a ze
Connect easily and reliably with two conductors. Wire sizes range from 0.5mm2 to 35mm2. Available with and without fuse. All products designed in accordance with IEC60998, UL1059, UL486E, CSA C22.2 No.158 standards.
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Parts & Supplies | Chipshooters / Chip Mounters
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the machines with very good competitive
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Technical Library | 2010-03-30 21:51:23.0
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
03009853-01 CENTERING PIN ROUND 03009896-01 assembly Y-cushion left X-4 03009903-01 assembly Y-cushion right X-4 03009924-02 Videomultiplexer 03009940-03 Upper Frame compl. 03009963S03 slide-in framework 03009966-01 furnished material 0300997
03010187S01 PE-UHMW FOIL 42,5 x 0,5 mm x 40m/Rol 03010315S01 Maglev MWA120-0064 03010326S01 PE-UHMW GLUE TAPE 50 x 0,3mm x 16,5m 03010329S01 HOLDER FEEDER SLIDE SPRING/X8 03010352-01 Tension spring d=0,63* D=5,6* Lo=23,3 03010415
