Industry Directory | Manufacturer
We provide cost effective, custom printed circuit boards (PCBs) through an instant online system. We also provide PCB Assemb
Industry Directory | Manufacturer
professional manufacturer of pcb
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Mon Dec 27 13:34:28 EST 2010 | ppcbs
Does anyone have any experience in printing solder paste on a 0.0065" pad? I have a requirement to attach single chips with 600 to 2400 connections. The chip has a 0.005" solder ball, 0.010 pitch. Attaching to a substrate with a 0.0065" pad. An
Electronics Forum | Tue Dec 28 09:52:28 EST 2010 | flipit
Use a 0.002" to 0.003" thick stencil. Use an electroformed stencil from Photo Stencil or one of the others. Use -500 +635 paste or a -500 paste or type 5 or greater paste. I have printed at 0.008" pitch with 0.004" pads. It can be done.
Used SMT Equipment | Pick and Place/Feeders
Product number: KE - 2010L Products in detail Substrate size: Min: 50 mmx30mm Max: 330mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square elementor 26.5 X11mm Mount speed: 11000 CPH SMT precision: 0.05 MM Elem
Used SMT Equipment | SMT Equipment
Name:YSM20 Placement Speed: 90000cph(0.05sec/chip) Placement Range:03015~45X45mm L100mm Placement Station:140 Power Supply:3 phases AC 200/208/220/240/380/400/416V±10% Dimensions:L1374XW1857XH1445mm Weight:2100kg
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
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Parts & Supplies | Pick and Place/Feeders
Yamaha Feeder - SHIM T0.05 (KW1-M11BS-05) Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 156299
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
ORION Industries | http://orionindustries.com/pdfs/shielding.pdf
. Material Standard Width Acrylic 0.001” Copper 0.0014 - 0.008” 0.002” Tin Plated Copper 0.0014 - 0.008” 0.005” Aluminum 0.002 - 0.015” Rubber 0.0034” Stainless Steel 0.002 - 0.015” INSULATING SUBSTRATES Mater ia l Trade Name Th i ckness UL-F lame Rat ing Max
| https://pcbasupplies.com/smt-nozzles/page/9/
$ 75.00 Add to cart Camalot Custom Nozzle – Single Silver Solder, 25, 0.01, 0.005 $ 75.00 Add to cart Camalot Custom Nozzle – Single w/13mm Tip (no base), 22, 0.016, 0.008 $ 75.00 Add to cart Camalot Custom Nozzle
