Industry Directory: 0.005mm (3)

Z-Axis Connector Company

Industry Directory | Consultant / Service Provider / Manufacturer

custom manufacturer of miniature electronic connectors based on fine line flex circuitry with 0,025mm conductors on 0,05mm pitch.

New SMT Equipment: 0.005mm (27)

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

ETA SMT Stencil Printers

ETA SMT Stencil Printers

New Equipment | Printing

Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: 0.005mm (22)

how to solder manganin 0.05mm manganin wire to a copper plate

Electronics Forum | Thu Jan 29 05:13:35 EST 2015 | neeraj_iiser

how to solder manganin 0.05mm manganin wire to a copper plate

Industry-Wide DFM Guideline - IPC, ANSI, etc?

Electronics Forum | Thu Apr 16 21:24:47 EDT 2009 | davef

500||0.00305mm/V||0.005mm/V||0.0254mm/V

Used SMT Equipment: 0.005mm (297)

Yamaha YS12F

Yamaha YS12F

Used SMT Equipment | SMT Equipment

Name:YS12F Placement Speed: 20000cph(0.18sec/chip) Placement Station:47 PCB Dimensions: 510*460 Accuracy: ±0.05mm Power Supply:3 PH, 200-415V Machine Dimensions: 1254*1755*1450 Weight: 1370kg

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YS12P

Yamaha YS12P

Used SMT Equipment | SMT Equipment

Name:YS12P Placement Speed: 24000cph(0.15sec/chip) Placement Station:59 PCB Dimensions: 510*460 Accuracy: ±0.05mm Power Supply:3 PH, 200-415V Machine Dimensions: 1254*1440*1450 Weight: 1250kg

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.005mm (16)

The LCO-350 PCB Laser Depanelizer: Precision Redefined

Industry News | 2023-10-30 01:28:24.0

In the fast-paced world of electronics manufacturing, achieving precision and efficiency is paramount. The LCO-350 PCB Laser Depanelizer stands as a revolutionary solution, pushing the boundaries of PCB (Printed Circuit Board) cutting technology.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

I.C.T-5700 VS I.C.T-IR350: How to Choose the Right Automatic PCB Separator

Industry News | 2023-10-30 06:11:57.0

When it comes to selecting an automatic PCB separator, the decision can be pivotal for your manufacturing process. We understand that precision, operational mode, speed, and cost-effectiveness are significant factors in this choice. In this comparison, we'll explore the differences between two of our outstanding products, the I.C.T-5700 and the I.C.T-IR350, to help you make an informed decision.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Parts & Supplies: 0.005mm (36)

Yamaha YG200 YAMAHA  medium speedchip mounter

Yamaha YG200 YAMAHA medium speedchip mounter

Parts & Supplies | Semiconductor & Solar

Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YAMAHA YV100XG

Yamaha YAMAHA YV100XG

Parts & Supplies | Assembly Accessories

Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: 0.005mm (1)

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Technical Library | 2020-12-24 02:50:56.0

A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.

University of Southampton

Videos: 0.005mm (108)

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global


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