Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
Industry Directory | Distributor
Custom-Fasteners.com specializes in manufacturing hard to find micro screws to specification, supplying OEMs and manufacturers worldwide.
New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle
1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X
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Used SMT Equipment | SMT Equipment
Name:YV100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:100 Power Supply:3P/200V-416V/KVA Dimensions:1650X1408X1850mm
Used SMT Equipment | Pick and Place/Feeders
Model :KE-2070 Placement speed：Chips:16, 000CPH(0.225sec/chip) Ics:4,600CPH(0.7sec/IC) Component mount range:0.4x0.2mm~□33.5mm Station:80 Power supply:3P/200~415V/3KVA Size:1,400x1, 393x1, 455mm Weight:1,530kg
Industry News | 2003-04-04 07:39:52.0
Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch
Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Parts & Supplies | Pick and Place/Feeders
SONY E1000 nozzle AF05021 SONY E1000 PICK UP NOZZLE0.45 /0.2 AF06040 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF06041 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF08050 SONY E1000 PICK UP NOZZLE0.8 /0.5 AF10070 SONY E1000 PICK UP NOZZLE1.0 /0.7 AF10071 SONY E
Parts & Supplies | Pick and Place/Feeders
SONY E1000 nozzle AF05021 SONY E1000 PICK UP NOZZLE0.45 /0.2 AF06040 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF06041 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF08050 SONY E1000 PICK UP NOZZLE0.8 /0.5 AF10070 SONY E1000 PICK UP NOZZLE1.0 /0.7 AF10071
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
Right Transportation Speed 1500mm/s Feeding Mode Section type transportation guide rail Rail Width Adjustment Automatic Communication Signal SMEMA PCB Positioning Upper and lower guide rail
Events Calendar | Sun Dec 01 00:00:00 EST 2024 - Tue Dec 31 00:00:00 EST 2024 | Lewisville, Texas USA
BGA Rework Station Showroom Open House
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS w/3.0 min GPA, 0-2+ years experience using rational rose or similar OO case enviornment UML or comparable rotation scheme, Win NT, Networking communications, embedded systems; Must also know object oriented analysis, design
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
| https://pcbasupplies.com/bent-sharp-30deg-9/
″) $ 17.85 Add to cart Thermaltronics M6SB275, M7SB275, M8SB275 Bent Sharp 30deg 0.4mm (0.016″) $ 17.85 Add to cart Thermaltronics M6SB275H Bent Sharp 30deg 0.5mm (0.02″), Power Plus
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/efd/products/fluid-dispensing-systems/ultimusplus-i-ii-dispensers
I은 0.7-7.0bar(10-100psi) 압력 조절기를 특징으로 하며 광범위한 유체 디스펜싱에 이상적입니다. UltimusPlus II UltimusPlus II는 0.02-1.0bar(0.3-15psi) 압력 조절기를 특징으로 하며 저점도 또는 얇은 유체를 디스펜싱할 때 보다 효과적으로 제어합니다. 특징 다국어로 제공되는 업계 최고의 직관적인 터치스크린 인터페이스 완전한 작업자 잠금 기능을 갖춘 전자식 압력 조절 바코드 스캐너 옵션 멀티샷™
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