Industry Directory | Equipment Dealer / Broker / Auctions
Shenzhen Xinruiming Technology Co.,Ltd which brand is Huarigor was founded in 2007 with $0.8M registration capital. Our $3Million state-of-the art production facility comprises 6 automatic assembly lines to produce replacement bat
Industry Directory | Manufacturer
professional manufacturer of pcb
JUKI JM-100 Hybrid Placement Machine Board size 410×360mmComponent Size: 0603～50mmPlacement Speed:16,000CPHPCB Weight max.4kgProduct description: JUKI JM-100 Multi Task Platform Hybrid Placement Machine, Board size 410×360mm, Component Size: 0603～50
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Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00
Electronics Forum | Mon Nov 15 15:31:54 EST 2004 | GP
We are looking for machine that can do the following: bonding of 0.5x0.5x0.8mm mm cramic part. - detect target surface position 1.5x0.8mm - dispance a drop of 0.8mm of epoxy adhesive on trget surface with position accuracy of +/-0.04mm. - pick the 0.
Electronics Forum | Thu Jun 23 11:56:51 EDT 2005 | wjxingggg
Hi, all. There is one 0.8mmX0.8mm QFN on almost of our PWBAs. But the quality report showed that we got bad solder quality for this component. My question is which elements are the root cause for this situation frequently? Thanks.
Used SMT Equipment | SPI / Solder Paste Inspection
Product Name: Table Top 3D SPI Model Name: KY3020T Serial Number: SPI-2T 210 Voltage: 220Va.c, 1Phase, 50/60HZ Rated Current: 0.8 Amp Current Max.: 4 Amp SCCR: 10KA/220Va.c Capacity: 0.88 kW Weight: 95 Kg Machine Size (mm): 780 x 1100 x 734 IP Grade:
Used SMT Equipment | SMT Equipment
Name:YG200 Model:KET-100 Placement Station:80 Placement Speed:45,000cph(0.08sec/CHIP Equivalent) Placement Range:0402(Metric base )to□14mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1950XW1408 Weight:2080kg
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-03-26 08:37:32.0
Oregon-based PCB maker Merix Corporation today reported results for its third quarter ended March 1, 2003.
Parts & Supplies | Pick and Place/Feeders
KV8-M88E1-00X 0.8 E-RING FOR YAMAHA TOOLS More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Pick and Place/Feeders
SONY E1000 nozzle AF05021 SONY E1000 PICK UP NOZZLE0.45 /0.2 AF06040 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF06041 SONY E1000 PICK UP NOZZLE0.6 /0.4 AF08050 SONY E1000 PICK UP NOZZLE0.8 /0.5 AF10070 SONY E1000 PICK UP NOZZLE1.0 /0.7 AF10071
Technical Library | 2021-09-08 14:23:27.0
Although the electronics industry has largely settled on the use of SAC alloys for the assembly of the majority of lead free products, debate continues to exist over which SAC alloy – SAC305 (Sn3.0Ag0.5Cu) or SAC405 (Sn3.8Ag0.8Cu) – to use. The North American industry generally favours SAC405, while the Asian industry favours SAC305. SAC305 has the significant benefit of being less expensive than SAC405 owing to its lower silver content. However, there are lingering questions about whether the reliability of SAC305 is comparable to that of SAC405. Recent studies have concluded that no significant difference exists, but many potential applications were not studied. This paper compares the results of reliability testing of SAC305 and SAC405 in three different cases on a test vehicle representative of a mid-complexity server-type product which included a range of component types from CBGAs to discrete resistors.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
03023054-03 Barcode Laminate X-Feeder Sector 1 03023073-03 BarcodeLaminate X-Feeder Sector 3 03023618-01 SOKO Nozzle 7xx for A 5x2/a 3,8x0.8 03023746-04 machinery facing X-F MTC r 03023750S01 Slider 03023777-02 FEEDER SEALING /X-SERIES
Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
| https://pcbasupplies.com/thermaltronics-m80tz025-tweezers-cartridge-pair-knife-tinned-area-2-03mm-0-08/
» Thermaltronics M80TZ025 Tweezers Cartridge Pair – Knife Tinned area 2.03mm (0.08″) Thermaltronics M80TZ025 Tweezers Cartridge Pair – Knife Tinned area 2.03mm (0.08
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_calculator-qfp-pad-stack-invalid-number_topic1915.xml
: There are couple things that might... Author: Jeff.MSubject: 1915Posted: 22 Jun 2016 at 8:05amThere are couple things that might lead to a negative paste mask valueThe b dimension seems pretty small. Are you sure it's 0.08 mm
