Industry Directory | Distributor
EasySpheres is the exclusive worldwide provider of high quality, Kester solder spheres. We maintain a large inventory of sphere alloys and sizes, and since we specialize in the fulfillment of small orders, we are able to guarantee
Dealing in solder spheres material. Leaded and Lead-free. Also specialise in resale equipments for PCBA and semicon industries.
New Equipment | Solder Materials
WE HAVE BGA SOLDER BALLS, SOLDER SPHERES. Sizes from 0.20mm and up. Quantities from one to one million or more. Available in Lead & Lead Free Solder. One price for Lead, (Sn63Pb37) or Lead Free, (Sn96.5Ag3Cu0.5) in any of these listed solder ball
circle blade PCB cutting machine used for depaneling PCB that from FR4 and aluminium material. If you want know how to choose the best PCB separator for your PCB printed circuit board , please go and check our web: www.pcb-separator.com or sent
Electronics Forum | Thu Dec 23 11:46:38 EST 1999 | g cronin
I am looking for a vendor for solder spheres and tack flux for BGA reballing. Preferibly on the east coast or new england area. My current distributors have them but require a min purchase of 200,000 that's a lot of balls!!!! thanks greg
Electronics Forum | Thu Dec 23 16:42:52 EST 1999 | Wayne Bracy
Check out Aeroquip there website is www.aeroquip.com/spheres/default2.htm or contact MSD in New Hampshire at (603) 774-5894 Regards, Wayne Bracy
Used SMT Equipment | Labeling Systems
Specification: Type ALS03 Equip. No. 023037 Prod. Year: 07.2007 Manufacturer: ASYS GmbH Machine Configuration Transport height - 850 mm ± 50 mm Max. transport width - 460 mm Interface
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Parts & Supplies | Circuit Board Assembly Products
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Career Center | Research Triangle Park, North Carolina USA | Sales/Marketing
Worldwide supplier of solderpaste, flux, adhesives and solder sphere's seeking Independant Manfacturers' Representatives for select protected territories in Illinois, Ohio, Pennsylvania, New York, New Jersey and the Provinces of Canada. Experience in
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. Since the flux is in constant contact with the solder powder, it is continually acting on the oxides on the surfaces of the solder powder or spheres, and this action reduces the activity levels of the fluxes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
value of 1x108 Ω or greater. Slump Test defined in IPC TM-650 2.4.35 to measure the change in shape of solder paste after deposition and before reflow. Solder Balls Small spheres of solder that have separated from a solder deposit during reflow
