AUTOTRONIK-SMT is a German company provides High Precision SMT Pick & Place Machine, Stencil Printer,Reflow Oven. which are low-cost, high accuracy ,with Laser & Vision alignment, can handle 0201,0402,SOIC,PLCC,Micro-BGA,0.3mm QFP,..etc.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
High accuracy, high flexibility for 0201 (0.6mm x 0.3mm),SOIC,PLCC,BGA,,CSP,QFP (0.3mm pitch). Smart feeder ID system provide fast set up and easy programming. Suitable for small & medium volume production. Vision On the Fly Alignment system. Bot
Electronics Forum | Mon Nov 16 20:22:52 EST 2015 | billthebuilder
I need one for testing a PnP machine. It's very hard to hunt something down just by package, so does anyone know of anything with a 0.3mm pitch? BGA preferred. Or clues where to look? Thanks!
Electronics Forum | Tue Nov 17 17:05:50 EST 2015 | davef
Look here: http://www.topline.tv/Pitch.html We receive no benefit from posting the link above.
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Industry News | 2018-10-18 10:06:45.0
Design Decisions That Reduce Manufacturing Costs
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
_1.JPG)
E2306725000 TIMING BELT (YA) E2305721AA0 YM BRACKET R ASM.(TS4513N1820E200) E2305725000 YM BRACKET E23057250A0 YM BRACKET ASM.(AC800W) E2305760000 ROTARY SHAFT E2306715000 ETP BUSH E23067160A0 Y CARRIER BASE ASM E2306721000 TIMING BELT YA E2
Parts & Supplies | Pick and Place/Feeders
Smt Fuji QP341 nozzles 6.0x0.3mm nozzle used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozz
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
E-mail: tina@gdmoje.com
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
Lewis & Clark | https://www.lewis-clark.com/
: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability Dual-Vision Alignment System Integral Vacuum Max Placement Area: 13.8″ x 17.1
