Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
New Equipment | Board Handling - Conveyors
pcb turning conveyor can be used for board loading and unloading of 90 degree lifting angle in SMT production line. The supply voltage, transport height, transport direction can be set according to customers' requirements. If you want know mor
Used SMT Equipment | SMT Equipment
Model :JUKI KE750 condition:used year: 2010 theory speed ：0.25sec 3 heads, Laser correction accuracy :0.08mm Angle accuracy :0.001 degree PCB thickness :0.4MM~4MM Parts mounting dimensions:1.0*0.5MM~32MM*11MM.QFP 20MM*20MM. voltage:single-
Used SMT Equipment | Pick and Place/Feeders
JUKI KE750 SMT machine Model :JUKI KE750 condition:used year: 2003 theory speed ：0.25sec 3 heads, Laser correction accuracy :0.08mm Angle accuracy :0.001 degree PCB thickness :0.4MM~4MM Parts mounting dimensions:1.0*0.5MM~32MM*11MM.QF
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
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Events Calendar | Wed Mar 17 18:30:00 UTC 2021 - Wed Mar 17 18:30:00 UTC 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
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2AGKNX005303 FUJI NXT III H24 Head 0.4mm Pick And Place Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html
=/>0.4mm Communication Plug SMEMA Signal Plug for up/down line Double-wire cable power consumption Approx.50W Weight Approx.200Kg Note: Can customized the longer PCB board for the LED production line Contact Us Whether you'd like to get more info on what,why and how we do what we do, need help with what you're creating,would line to
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