Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable
New Equipment | Board Handling - Conveyors
Our SMEMA-compatible transfer conveyors are used for equipment linking, visual inspection, manual assembly, and PCB buffering functions. The front rail is stationary while rear rail adjusts to desired width with a hand crank. Conveyor speed is dial a
Electronics Forum | Mon Mar 04 22:50:03 EST 2002 | Nell
Hi, Could anyone tell me where can I get the 0.4mm pitch CSP Dummy Component and the Test PCB? Any comments will be appreaciated. Thanks and Regards. Nell
Electronics Forum | Fri Sep 22 17:36:35 EDT 2006 | mika
A bunch of thanks guys, we will take this in consideration. BTW, we will not go for the v-grove in the panel (2x8 boards + the extra cut of areas). The board house recommended us to go for braces/hinges, since this thin pcb-panel could easily break w
Used SMT Equipment | SMT Equipment
Model :JUKI KE750 condition:used year: 2010 theory speed ：0.25sec 3 heads, Laser correction accuracy :0.08mm Angle accuracy :0.001 degree PCB thickness :0.4MM~4MM Parts mounting dimensions:1.0*0.5MM~32MM*11MM.QFP 20MM*20MM. voltage:single-
Used SMT Equipment | Pick and Place/Feeders
JUKI KE750 SMT machine Model :JUKI KE750 condition:used year: 2003 theory speed ：0.25sec 3 heads, Laser correction accuracy :0.08mm Angle accuracy :0.001 degree PCB thickness :0.4MM~4MM Parts mounting dimensions:1.0*0.5MM~32MM*11MM.QF
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Parts & Supplies | Pick and Place/Feeders
Name of equipment: Samsung SM421, Samsung SM421 mounter, used Samsung SM421 mounter The latest arrival of Samsung SM421 mounter 18, 12-year machine, color state is excellent, welcome to buy! ! ! Brief introduction of equipment Samsung SM421
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Parts & Supplies | Pick and Place/Feeders
JUKI 504 Nozzle Name:JUKI NOZZLE Brand:JUKI Model:JUKI 504 Nozzle Specification:JUKI 504 Nozzle Condition:original/copy Quality:top qualiy Stock:large Payment:L/C T/T D/P Western Union Paypal Money Gram And Others shipment:In three days S
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
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ASCEN Technology | https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html
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