New Equipment | Solder Paste Stencils
ALPHA® Stencil products are based on unique blends of advanced technology, the experience gained from having made over half a million solder paste stencils, the specialist knowledge that could only be accumulated by a company privileged to produce bo
Advanced Solder Paste Printer with 2D and 3D SPI On-Board Standard Features Include: 3D Solder Paste Inspection 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Full Process Control Programmable
Electronics Forum | Wed Sep 13 20:04:37 EDT 2006 | mika
Hi, We have a customer that want us to produce a single sided 0.4 x 100 x 50 mm size RoHS pcba approx 1000 of them. The board only contains three 2.54mm pitch Non P.I.P, SMT-connectors. We have never produced such a thin pcb:s before. We are thinkin
Electronics Forum | Mon Oct 10 17:47:10 EDT 2005 | jhagve
hi We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Used SMT Equipment | Screen Printers
Speedprint SP1550 Long Board Screen Printer Model: SP1550 Year: 2021 Accuracy: +/- 12.5µm @ 6 sigma Cycle Time: 16 seconds Stencil Size (Max): 1850mm x 736mm PCB Size (Max): 1550mm x 560mm Board Thickness: 0.4mm to 6mm Max Weight: 10kg Underside Cle
Used SMT Equipment | Screen Printers
Speedprint SP1550 Long Board Screen Printer Model: SP1550 Year: 2020 Accuracy: +/- 12.5µm @ 6 sigma Cycle Time: 16 seconds Stencil Size (Max): 1850mm x 736mm PCB Size (Max): 1550mm x 560mm Board Thickness: 0.4mm to
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
ALPHA® TETRABOND™ is the culmination of "frameless" stencil development; an elegantly simple system designed to enhance the rigidity of the foil, making safe mounting and demounting an easier proposition. Innovatively encompassed in a thin, one piece
HP-520SPI Load a new program in 1 minute, 20 seconds Inspect a full size PCB in 8 seconds or less Closed Loop Feedback on X/Y, Theta, Insufficient-Excess Solder Paste and also Under Stencil Cleaning System
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
SMTnet Express, September 28, 2017, Subscribers: 30,862, Companies: 10,741, Users: 23,873 An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios Jasbir Bath, Tony Lentz, Greg
| https://pcbasupplies.com/k-series/
Quick Braid Anti-Static Sea Braid Anti-Static Stencil Rolls DEK EKRA GKG/Juki MPM Yamaha Stencil Wipes Solder Bar Solder Solid Core Solder Pick
ASCEN Technology | https://www.ascen.ltd/Blog/machines/214.html
=/>0.4mm Communication Plug SMEMA Signal Plug for up/down line Double-wire cable power consumption Approx.50W Weight Approx.200Kg Note: Can customized the longer PCB board for the LED production line ASCEN team provide a full SMT assembly line solutions,including
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