Industry Directory: 0.5mm pitch bridging (4)

Beau Tech

Beau Tech

Industry Directory | Manufacturer

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

New SMT Equipment: 0.5mm pitch bridging (34)

Automatic splicing machine BMHP-08 BMHP-24

Automatic splicing machine BMHP-08 BMHP-24

New Equipment | Other

Automatic splicing machine BMHP-08 BMHP-24  It replaces manual labor to splicing,suitable for8-24mm splicing Tape  it has the function of Barcode comparison,detectsempty pockets of the component reels,Font&charactersprinting comparison,Systems inter

Qinyi Electronics Co.,Ltd

FCI's 0.5mm Pitch FPC Connector Increases Cable Retention

FCI's 0.5mm Pitch FPC Connector Increases Cable Retention

New Equipment |  

Incorporating a cable lock option, the 62674 series of 0.5mm pitch vertical connectors from FCI provides a high cable retention force for flexible printed circuits. Preheld by the connector's compact slider mechanism, cables are easily mated in a ze

FCI

Electronics Forum: 0.5mm pitch bridging (390)

0.5mm pitch BGA

Electronics Forum | Wed Dec 05 17:44:25 EST 2001 | LloydG

we are in the process of design, plan to use a 0.5 mm pitch BGA. does someone has a recommended footprints. thx!

alignment requirements for 0.5mm pitch

Electronics Forum | Sun May 05 08:13:14 EDT 2002 | andysi

I am curreently in my final year of my HNC Mechatronics course. In the project section I am reviewing several screen printers for their suitability to run a new product containing 0.5mm pitch components. I would be interested in anyones opinion in

Used SMT Equipment: 0.5mm pitch bridging (42)

Samsung chip mounter CP45FV04

Samsung chip mounter CP45FV04

Used SMT Equipment | Flexible Mounters

Product Name: Samsung chip mounter CP45FV04 Product number: CP45FV04 Detailed product introduction Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max speed IPC9580, 14900CPH 0.178sec/chip (1608); IC flying camera 0.75s

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung CP45FV-NEO chip mounter

Samsung CP45FV-NEO chip mounter

Used SMT Equipment | Pick and Place/Feeders

Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 0.5mm pitch bridging (86)

Parts & Supplies: 0.5mm pitch bridging (9)

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Yamaha Which series nozzles could be used for Phlips Topaz and Emerald machine

Parts & Supplies | Pick and Place/Feeders

Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and

ZK Electronic Technology Co., Limited

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: 0.5mm pitch bridging (8)

Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications

Technical Library | 2023-01-17 17:58:36.0

Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.

Heller Industries Inc.

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Technical Library | 2010-03-30 21:51:23.0

This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.

Flex (Flextronics International)

Videos: 0.5mm pitch bridging (13)

SMT On-line 3D Solder Paste Inspection ?

SMT On-line 3D Solder Paste Inspection ?

Videos

SMT On-line 3D Solder Paste Inspection ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in

Dongguan Intercontinental Technology Co., Ltd.

Online AOI Machine

Online AOI Machine

Videos

ETA DIP Inverted Camera Online AOI Machine ETA-V5200 ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m

Dongguan Intercontinental Technology Co., Ltd.

Career Center - Jobs: 0.5mm pitch bridging (2)

Senior Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i

intiGrow

Assembler 2 – IPC 610 – 1st Shift

Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production

Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify

Lockheed Martin Corporation

Career Center - Resumes: 0.5mm pitch bridging (1)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: 0.5mm pitch bridging (209)

Partner Websites: 0.5mm pitch bridging (4764)

428767 - Chill Plate, Wide Pitch

Heller Industries Inc. | https://hellerindustries.com/parts/428767/

428767 - Chill Plate, Wide Pitch Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

PCB Libraries Forum : Axial Components Pitch Calculation

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_axial-components-pitch-calculation_topic1896.xml

0.5mm lead dia.Once those issues are considered, the lead pitch becomes your choice. Axial Components Pitch Calculation : Eventually the Axial Lead Pitch... Author: Tom HSubject: 1896Posted: 26 May 2016 at 6

PCB Libraries, Inc.


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