Industry Directory | Equipment Dealer / Broker / Auctions
Shenzhen Xinruiming Technology Co.,Ltd which brand is Huarigor was founded in 2007 with $0.8M registration capital. Our $3Million state-of-the art production facility comprises 6 automatic assembly lines to produce replacement bat
We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
Wisdom Shining Electronic Technology (China) Limited has a large inventory for PANASERT HDP HDF nozzle.We can provide free after-sales service and technical service.The details of PANASERT HDP HDF nozzle are as below: PANASERT HDP 1D/1S ø0.7/ø0.4 P
Tungsten Sheet,Plate,Boat,Cake,Alloy,Ball,Bar,Foil,Rod Alloy Sheet Foil Bar Wire W1 0.5-8.0 0.03-0.5 ��f2.0 f0.05-2.0 CW1 0.5-8.0 0.05-0.5 f2.0-5.0 f0.12-1.8 W2 0.5-8.0 0.05-0.5 ��f2.0 f0.12-1.8 WAl1 f2.8-11.0 f0.12-1.8
Electronics Forum | Tue Feb 16 14:04:10 EST 2016 | tsvetan
We are designing board which have to plug in M.2 connector and thickness is limited to 0.8 mm The board is very complex with many BGAs and DDR3 memory chips and we will need 6 layers for routing. The problem is that we will need signals with 50, 90
Electronics Forum | Tue Feb 16 15:42:21 EST 2016 | sarason
When faced with a problem like this I sometimes look at competitive products and see what they have done. You may be able to get away with 4 layers if you have the space, however if it is jammed up that will not be an option. I presume that the total
Used SMT Equipment | SPI / Solder Paste Inspection
Product Name: Table Top 3D SPI Model Name: KY3020T Serial Number: SPI-2T 210 Voltage: 220Va.c, 1Phase, 50/60HZ Rated Current: 0.8 Amp Current Max.: 4 Amp SCCR: 10KA/220Va.c Capacity: 0.88 kW Weight: 95 Kg Machine Size (mm): 780 x 1100 x 734 IP Grade:
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter CM202-DH/DS Product number: CM202-DS Detailed product introduction High speed chip CM202-DH /DS Panasonic Theoretical speed: 0.1SEC/SOP, IC 0.088SEC/CHIP Material station: 160 station (40*4) Work
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-02-12 09:25:17.0
35% stake in Topgrow Technologies
Parts & Supplies | Pick and Place/Feeders
KV8-M88E1-00X 0.8 E-RING FOR YAMAHA TOOLS More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Parts & Supplies | Assembly Accessories
TAPE GIIDE CP6/CP7/CP8/XP Ø1.0（8x4）
Technical Library | 2021-09-08 14:23:27.0
Although the electronics industry has largely settled on the use of SAC alloys for the assembly of the majority of lead free products, debate continues to exist over which SAC alloy – SAC305 (Sn3.0Ag0.5Cu) or SAC405 (Sn3.8Ag0.8Cu) – to use. The North American industry generally favours SAC405, while the Asian industry favours SAC305. SAC305 has the significant benefit of being less expensive than SAC405 owing to its lower silver content. However, there are lingering questions about whether the reliability of SAC305 is comparable to that of SAC405. Recent studies have concluded that no significant difference exists, but many potential applications were not studied. This paper compares the results of reliability testing of SAC305 and SAC405 in three different cases on a test vehicle representative of a mid-complexity server-type product which included a range of component types from CBGAs to discrete resistors.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
ML-550 Automatic Blade Moving PCB Separator Features ●Suitable for horizontal designed PCB with V-scored groove. ●Automatic feeding and precise positioning to separate PCBA. ●PCB material:FR4.Aluminum,Copper,etc. ●49 sets of PCB data can be stor
Multi Blade V-Cut PCB Cutting Machine LED Strip PCB Separator V-cut PCB Cutting Machine Features: 1. It can cut many boards with multiple sets of knives work at the same time. 2. The knife flywheel is adjustable as a whole from 0 to 5mm 3. T
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/1-1-0-8-p-2-0-hdf-nozzle-2d-2s-1-1-0-8-p-2-0-215232?page=15&category=1154&order=name+asc
PANASONIC HDF NOZZLE 2D/2S 1.1/0.8 P=2.0 1.1/0.8 P=2.0 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products SMT Nozzles HDF NOZZLE 2D/2S 1.1/0.8 P
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Hewlett Packard 8731A PIN Modulator 0.8-2.4GHz ID_001578 (9/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
