Industry Directory: 005 (10)

GRSYS SERVICE

Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Manufacturer's Representative

GRSYS Services offers quality solutions and services to the electronics industry in Brazil. The team has a combined 20 years of marketing know-how with experience in equipment maintenance, process,service, applications and sales.

AA ACCURACY STEEL RULE DIE CO.

Industry Directory | Manufacturer

MANUFACTURER OF CLOSE TOLERANCE STEEL RULE DIES AND DIE CUTTING OF NONMETALLIC AND SOFT METALLIC MATERIALS. SHORT AND LONG RUNS.

New SMT Equipment: 005 (394)

Precision Lead Former for Taped RADIAL Components (CF-9)

Precision Lead Former for Taped RADIAL Components (CF-9)

New Equipment | Lead Forming

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Electronics Forum: 005 (222)

IPC-J-STD 005 USER PERFORMANCE INSPECTIONS

Electronics Forum | Tue Oct 17 16:07:12 EDT 2017 | bstogsdill

Thank you Dave, for the tip. I have sent an email to Mr. Newton.

IPC-J-STD 005 USER PERFORMANCE INSPECTIONS

Electronics Forum | Thu Sep 21 10:17:54 EDT 2017 | davef

I agree with you. IPC Committee 5-24b Solder Paste Task Group is responsible for maintaining J-STD-005, Requirements for Solder Pastes. They generate "standards, test methods, and a handbook that reflects current practices in all aspects of electro

Used SMT Equipment: 005 (484)

Juki KE - 2010L

Juki KE - 2010L

Used SMT Equipment | Pick and Place/Feeders

Product number: KE - 2010L Products in detail Substrate size: Min: 50 mmx30mm Max: 330mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square elementor 26.5 X11mm Mount speed: 11000 CPH SMT precision: 0.05 MM Elem

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YSM20

Yamaha YSM20

Used SMT Equipment | SMT Equipment

Name:YSM20 Placement Speed: 90000cph(0.05sec/chip) Placement Range:03015~45X45mm  L100mm Placement Station:140 Power Supply:3 phases AC 200/208/220/240/380/400/416V±10% Dimensions:L1374XW1857XH1445mm Weight:2100kg

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: 005 (80)

Parts & Supplies: 005 (1875)

Technical Library: 005 (4)

Dissolution in Service of the Copper Substrate of Solder Joints

Technical Library | 2019-06-20 00:09:49.0

It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.

Nihon Superior Co., Ltd.

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Technical Library | 2020-07-02 13:29:37.0

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.

Alpha Assembly Solutions

Videos: 005 (614)

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Training Courses: 005 (1)

IPC J-STD-001 Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Trainer (CIT)

The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.

Verion Training Systems, LLC

Career Center - Resumes: 005 (2)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

SMT Production and Process engineer

Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production

 Experience in handling Process related issues throughout the Product Manufacturability.  Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData  Programming and maintenance of Solder Paste Printer of DEK

Express Newsletter: 005 (16)

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge)

High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force

Partner Websites: 005 (300)

SMT nozzle 21003-61000-005 Mirae nozzle

| http://www.feedersupplier.com/sale-13118996-smt-nozzle-21003-61000-005-mirae-nozzle.html

SMT nozzle 21003-61000-005 Mirae nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

5165 - Shim .875 id X 1.25 od X .005 Thk

Heller Industries Inc. | https://hellerindustries.com/parts/5165/

5165 - Shim .875 id X 1.25 od X .005 Thk Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.


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