Industry Directory: 01005 pad design (44)

PCB Libraries, Inc.

PCB Libraries, Inc.

Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other

PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.

Power Designers Sibex

Industry Directory | Manufacturer

Power Designers Sibex is located in Florida with a combined manufacturing area of 125K square feet. Quality: ISO9001:2008, ISO13485 Medical, UL Approval and ITAR registered. Military, Medical, Commercial

New SMT Equipment: 01005 pad design (202)

SMT Dispensing Pumps for Integration

SMT Dispensing Pumps for Integration

New Equipment | Dispensing

Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti

GPD Global

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

Electronics Forum: 01005 pad design (1227)

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem

Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia

BGA pad design

Electronics Forum | Fri Nov 27 00:36:02 EST 2015 | slouis2014

I just encountered a BGA design were in, underneath the BGA is a silkscreen that covered the entire bottom of the component except for the copper pads. Can you give any information and advice for this type of design.

Used SMT Equipment: 01005 pad design (85)

Manncorp MC-389CY-F3-V

Manncorp MC-389CY-F3-V

Used SMT Equipment | Pick and Place/Feeders

MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive

Baja Bid

Manncorp MC-389

Manncorp MC-389

Used SMT Equipment | Pick and Place/Feeders

Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c

Baja Bid

Industry News: 01005 pad design (758)

Integrate Advanced Precision Auger Pump for Dispensing Small Volumes down to 01005

Industry News | 2016-08-25 17:56:34.0

GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.

GPD Global

GPD Global Pushes the Limits for Small Volume Dispensing The new Nano-Piston Pump is now available

Industry News | 2013-10-10 09:56:45.0

GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.

GPD Global

Parts & Supplies: 01005 pad design (52)

Juki RX 7 JUKI  high-speed module chipmounter

Juki RX 7 JUKI high-speed module chipmounter

Parts & Supplies | Pick and Place/Feeders

Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

I-Pulse I Pulse 0201 01005 03015 Nozzle

I-Pulse I Pulse 0201 01005 03015 Nozzle

Parts & Supplies | Assembly Accessories

M001 I-PULSE Nozzle M2  PK NZ -N001 (0.5 X 0.4)mm N002 I-PULSE Nozzle M2  PK NZ -N002 (0.9 X 0.62) N003 I-PULSE Nozzle M2  PK NZ -N003 (1.3 X 0.7) N004 I-PULSE Nozzle M2  PK NZ -N004 (1.8 X 1.2) N005 I-PULSE Nozzle M2  PK

KingFei SMT Tech

Technical Library: 01005 pad design (35)

PCB vias design recommendation

Technical Library | 2019-05-29 01:47:22.0

1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.

PCBNPI-Professional PCB Fab/PCB Assembly Service Provider From China

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Technical Library | 2023-07-25 16:50:02.0

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Photo Stencil LLC

Videos: 01005 pad design (97)

Precision Auger Pump Cleaning - Easy

Precision Auger Pump Cleaning - Easy

Videos

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Training Courses: 01005 pad design (13)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: 01005 pad design (9)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: 01005 pad design (4)

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r

Molex, Incorporated

Career Center - Resumes: 01005 pad design (11)

SMT Process Engineer

Career Center | Fremont, California USA | Engineering,Production

4 years of PCB assembly process.

PCB Designer(s)

Career Center | Newport Beach, California USA | Engineering,Management,Production

KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997

Express Newsletter: 01005 pad design (1085)

01005 production goes industry wide

01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult

Partner Websites: 01005 pad design (3597)

Design SMT pad for magnet wire - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/design-smt-pad-for-magnet-wire_topic1206.html

Design SMT pad for magnet wire - PCB Libraries Forum   Forum Home > PCB Footprint Expert > Questions & Answers    New Posts    FAQ    Search    Events    Register    Login Design SMT pad for magnet wire

PCB Libraries, Inc.

Solder Paste Dipsense Systems -Dots, Lines, Complex Shapes, 01005, 0402

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-dispenser.php

Solder Paste Dipsense Systems -Dots, Lines, Complex Shapes, 01005, 0402   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global


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