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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
A turret modular mounting systems features both a high throughput and a high level of area productivity. High throughput of 48,000 cph with smallfootprint The mounter achieves an area productivity of 10,000 cph/m2 (under optimum operating co
Electronics Forum | Fri Jan 24 16:54:24 EST 2014 | davef
Yeh, I worked at Wang Computer factory in a reclaimed fabric mill with wooden floors. One of the causes of grapping is flux loss. In their paper, Briggs and Laskey talk about flux loss due to spreading and suggest: * Graping is much less prevalent i
Electronics Forum | Wed Jul 20 16:51:03 EDT 2005 | pjc
There is a spec I read that states +/- 0.001" (0.025mm) print deposition accuracy and repeatability is more than adequate for 0201-chip printing. I don't think any print studies where done for 01005 chips yet. There are several other factors besides
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
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Parts & Supplies | Assembly Accessories
8x2mm PA-NST for 01005 (= 0402 metric), red handle 8x2mm PA-NST for 0201 (= 0603 metric), green handle For SM series machines (400series, 321series: SM320, SM321, SM411, SM421) 8x2mm for 01005, 0201 and 0402 (red, green and blue handle) 8x4mm
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
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we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn
01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components miniature size made them difficult
0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
. Receive a discount on your conference registration. 4. Be eligible for cash prizes for best paper awards : Top 3 for best of proceedings/paper = $1000/$500/$500 Best of conference (panels excluded) = $1000
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) 01005 50934804 12mm High Performance (Gold Plus) Spliceable Tape Feeder 50934805 12mm High Performance (Gold Plus) Spliceable Tape Feeder 50934806 12mm High Performance (Gold Plus
