Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Industry Directory | Manufacturer
Leading supplier of highly engineered products and solutions, components and subsystems to top manufacturers, major government contractors, international government and military organizations.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Rework & Repair Equipment
Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN
Electronics Forum | Sun Oct 11 16:20:49 EDT 2020 | kumarb
Hi. My 2 bits...from your list, we have had communication with Seamark and our experience so far has been very positive. We are reviewing to purchase one of their BGA rework systems, primarily from the video on youtube showing Louis Rossman running o
Used SMT Equipment | Chipshooters / Chip Mounters
Chip 90,000CPH (0.040Sec. / chip / Optimum）66,000CPH (IPC9850) 0402mm(01005 inch) ~ 33.5mm×33.5mm Laser recognition : ±0.05mm(±3σ) On-the-fly centering using integrated laser 2 stations, 4 gantries, 4 placement heads, 24 nozzles Linear servo mot
Used SMT Equipment | Repair/Rework
VJ Electronix Benchtop Solder Rework System Vintage: 2013 Model: SRT Micra Micro Assembly & Small Board Rework System High Resolution Vision System Convection Top & Bottom Site Heating Spot Heater 0.3mm Pitch Process Capability 01005
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2010-09-15 21:42:29.0
The SMTA Penang Chapter is pleased to announce its 3rd Vendor Show in Penang, Malaysia taking place on November 19th, 2010 at the Eastin Hotel Penang, Malaysia. In conjunction to the tabletop exhibition, a free technical conference will provide attendees timely information related to surface mount technology and future trends in electronics assembly.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
The VJ Electronix XQuik with AccuCount is designed to reduce time and manpower required for incoming inspection and cycle counting of electronic components. Simply place the component reel inside of the x-ray cabinet and press “COUNT”. There is no pr
Higher, faster, further! And also bigger: Ersa HR 600 XL – the ultimate solution for professional big board rework up to 24 x 24 inches. See the capabilities and flexibility of this exciting machine. More about HR 600 XL ? https://big-board-rework.de
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts
SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
(01005, Leadless Components, PoP) Rework Reliability Robotic Soldering Selective Soldering Solder Jetting Solder Paste/Solder Voids in Joints Solderless Interconnections Supplier Engineering Thermo Compression Bonding Underfill
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_AdvMicroSMT.pdf
& Operator Certification Bare Board Inspection ■ IPC-A-600 Instructor & Operator Certification ■ IPC-6012 Instructor & Operator Certification Rework & Repair ■ IPC-7711
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