Industry Directory | Manufacturer
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.
Industry Directory | Manufacturer
Leading supplier of highly engineered products and solutions, components and subsystems to top manufacturers, major government contractors, international government and military organizations.
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SMT Samsung CP feeder 8x2mm, PA-NST for 01005 pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER SAM
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Used SMT Equipment | Chipshooters / Chip Mounters
Chip 90,000CPH (0.040Sec. / chip / Optimum）66,000CPH (IPC9850) 0402mm(01005 inch) ~ 33.5mm×33.5mm Laser recognition : ±0.05mm(±3σ) On-the-fly centering using integrated laser 2 stations, 4 gantries, 4 placement heads, 24 nozzles Linear servo mot
Used SMT Equipment | Repair/Rework
VJ Electronix Benchtop Solder Rework System Vintage: 2013 Model: SRT Micra Micro Assembly & Small Board Rework System High Resolution Vision System Convection Top & Bottom Site Heating Spot Heater 0.3mm Pitch Process Capability 01005
Industry News | 2010-09-15 21:42:29.0
The SMTA Penang Chapter is pleased to announce its 3rd Vendor Show in Penang, Malaysia taking place on November 19th, 2010 at the Eastin Hotel Penang, Malaysia. In conjunction to the tabletop exhibition, a free technical conference will provide attendees timely information related to surface mount technology and future trends in electronics assembly.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Parts & Supplies | Pick and Place/Feeders
YAMAHA 8mm Cl feeder 01005 PN 9498 396 02008 PA 2903-96 for smt machine Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha C
Parts & Supplies | Pick and Place/Feeders
YAMAHA 8mm Cl feeder 01005 PN 9498 396 02008 PA 2903-96 for smt machine Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha C
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts
SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA
| https://pcbasupplies.com/midas-b12-nozzle-0-13mm-id-spring-tool-for-01005-components/
Count On Tools L-012-0884 Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
(01005, Leadless Components, PoP) Rework Reliability Robotic Soldering Selective Soldering Solder Jetting Solder Paste/Solder Voids in Joints Solderless Interconnections Supplier Engineering Thermo Compression Bonding Underfill
