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New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish
Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Samsung Part Name: Power Supply Model: STW400-24 Machine Model: SM482 Condition: Original Used Location: Shenzhen STW400-24 Power Supply For Samsung SM482 Surface Machine Original Used Description: 1, Bra
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Model: MSMA152A1C Name: AC Servo Motor Input: 200V Current: 9.4A Output: 1.5KW 1500W AC Servo Motor MSMA152A1C For Samsung CP45 Surface Mount Machine Detail Information: 1, Part Name: AC Servo M
1.Product parameter Total Power 2500W Top heater 1200W Bottom heater 1200W Power AC110~240V±10％ 50/60Hz Operation mode
Dinghua Technology --- the biggest manufacturer of BGA/SMD rework machine in the China. We are the supplier for V-tech, Huawei, Sumsung, Lenovo and Foxconn etc.. Contact: John skype: sinobga32
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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
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, or other type of heat spreader. l Between CPU and Heat Spreader l Between a semiconductor and heat sink Property Typical Value Method Mechanical Thickness .020" to
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Power and High Temp Electronics Manufacturing Dr. Chris Hunt and Bob Willis Free! 2014 Higher Density Packaging: Manufacturability & Reliability Cheryl Tulkoff $200.00 2014 Tin Whiskers: All You Should Know
