Effective Solutions for any Odd-Form Application on any OEM Platform. Count On Tools has the experience and manufacturing flexibility to be able to develop custom engineered solutions to satisfy your individual Process Requirements. With over 20 y
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Wed May 17 17:27:58 EDT 2006 | smt_guru
My consultancy firm will perform a process capability analysis on your 0201 feeder performance characteristics. We will leverage and integrate various feeder designs utilizing electro-mechancial design modeling and simulation. Please consult us in
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1962B-E1963A-E1968A-F0201A-F0202AAgilent-HP E5515C-002-003-E1968A-101-E1968A-102-E1968A-103-E1968A-410-E1963A-E1963A-403-E1963A-413-F0201A-F0202A-E1962B-E1962B-406; 8960 Series 10 Wireless Communications Test Set The industry
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2011-10-03 15:19:17.0
IPC invites accredited U.S. and international colleges and universities with a strong focus on the electronics industry to submit paper abstracts for IPC’s International Academic Paper Competition.
Industry News | 2003-05-30 07:52:35.0
New courses on today's most important topics in electronics manufacturing, assembly, and related business issues
Parts & Supplies | Pick and Place/Feeders
SMT YAMAHA 0201 KW1-M1500-00X pick and place nozzle Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha CL 8*4mm Feeders KW1
Parts & Supplies | Pick and Place/Feeders
SMT YAMAHA 0201 KW1-M1500-00X pick and place nozzle Yamaha CL Feeders models: Part Number: Yamaha CL Feeder KW1-M1500-030 Yamaha CL 8*2mm Feeders for 0201 KW1-M1400-00X Yamaha CL 8*2mm Feeders for 0402 KW1-M1100-000 Yamaha CL 8*4mm Feeders KW1
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Just released a new Digital Multimeter with a record number of features: • L-C-R-ESR-LED/Diode Test, 0.1% Basic Accuracy • Measurements of Frequency, Period, Duty Cycle to 400 kHz • Oscilloscope 100 kHz, AC/DC Voltage up to 15 V • Signal Generator: S
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1384&OB=DESC.html
. Can you confirm if this is now correct to standard with the PADS ascii output? Thanks for the background. The micro chip components are the ones I like to update when I see things have changed because these can cause the most issues with PCB assemblers
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Issues With Main Stream Pb-Free Soldering Polina Snugovsky, Simin Bagheri, Marianne Romansky, Doug Perovic, Leonid Snugovsky, John Rutter Abstract 25-2 Investigation of Factors that Influence Creep Corrosion on Printed Circuit Boards Haley Fu, Cherie Chen
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