Industry Directory | Consultant / Service Provider / Media / Publisher / Online Resource / Other
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
SMT Plus offers online and onsite technical training in addition to selling technical publications for SMT design and manufacturing. SMT Plus is a leader in supplying land pattern libraries to the industry.
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Electronics Forum | Tue May 04 11:34:06 EDT 1999 | Ken Pishko
Need a footpint for a 10 lead uSOIC (RM-10)
Electronics Forum | Thu Mar 21 15:36:19 EST 2002 | slthomas
We're having trouble with a TO-252 DPAK from Fairchild (MC7805CDT) and our existing land pattern. The land pattern calculator on the IPC site doesn't have anything available that matches it (there are no TO-252's available on the pull downs), and I'
Used SMT Equipment | SMT Equipment
JUKI 12500CPH KE2060 mounter, chip (laser identification / actual production efficiency) 1850CPH:IC (such as image recognition / actual production efficiency), 3400CPH:IC (image recognition / use MNVC) laser post titles x 1 (4 nozzle) & high resoluti
Used SMT Equipment | SMT Equipment
JUKI 12500CPH KE-2060 SMT Chip (laser identification / actual production efficiency) 1850CPH:IC (such as image recognition / actual production efficiency), 3400CPH:IC (image recognition / use MNVC) laser post titles x 1 (4 nozzle) & high reso
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
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Parts & Supplies | Pick and Place/Feeders
F1-82-1005 LG4-M2A00-040 YAMAHA FEEDER Condition: New Stock: Yes Packaging: Cleaning Transportation: Ocean,Land,Air Place of Origin: Dongguan HS Code: 8479909090 YAMAHA Feeder in Stock YAMAHA CL KW1-M1500-030 8MM 0201 8X2 YAMAHA CL
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development
Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).
| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
(correct solder pad size and land pattern) for the same component listed in the Bill of Materials (BOM). The mismatch of component footprint spacing is usually an error created when components on the PCB assembly ( PCBA
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