Industry Directory | Manufacturer
Autorised distributors of Fuji Machine Mfg & JBC Soldering Equipment
Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
JUKI LX-8 Pick and Place Machine Applicable Components: 0201Board size:410×400mmFeeder inputs:136placement capacity:105,000CPHProduct description: JUKI LX-8 Pick and Place Machine,Applicable Components: 0201,Board size:410×400mm,placement capacity:1
Hanwha HM520 HS Pick and Place Machine Placement Speed:80,000 CPH Components: 0201 - 6 mm PCB Dimension, Single: 510 x 580mm Double:- 510 x 310mm Weight:1,605kg Dimension (LxDxH): 890x2,312x1,921mm Hanwha HM520 HS Pick and Place Machine Hanw
Electronics Forum | Thu Mar 01 16:39:29 EST 2012 | triadelectronics
Our company is going to attempt to place 0201 components using our Fuji CP4-3 with the upgraded SMD3 vision system. Count On Tools is providing the 0.4 mm nozzles and we are using our 8mmX2mm feeders with the 0.7mm tape leaf (if it works at all we w
Electronics Forum | Mon Mar 03 08:04:57 EST 2003 | bphillips
0201 chip placement has been very challenging, how can I validate my chip shooter's quality performance with this size chip?
Used SMT Equipment | SMT Equipment
Model:YV100Xg Placement Speed: Chips :20000cph(0.18sec/chip) Placement Range:0201 chips ~32mm Placement Station:100 Power Supply:3PH/200V-415V/4.4KVA Dimensions:1650X1408X1850mm Weight:1600kg
Used SMT Equipment | SMT Equipment
Model:YV100Xg Placement Speed: Chips :20000cph(0.18sec/chip) Placement Range:0201 chips ~32mm Placement Station:100 Power Supply:3PH/200V-415V/4.4KVA Dimensions:1650X1408X1850mm Weight:1600kg jenny@ksunsmt.com
Industry News | 2011-03-31 10:59:52.0
Count On Tools now offers redesigned Juki 509 Ceramic Nozzles in both gold and silver styles. This nozzle design enables highly accurate, repeatable, optimized chip placement for 0201 micro-components.
Industry News | 2011-02-07 15:28:03.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.
Parts & Supplies | Pick and Place/Feeders
Feature : Hitachi Sanyo Universal UIC SMD SMT Component Feeder. Part Name: 8x2mm Paper Feeder with 7 Inch Reel Holder for 0402 0201 Chip. Part Number: CT-0885 . For Hitachi Sanyo TCM1000 TCM3000 Electronics Applied Systems Universal UIC HSP-479
Parts & Supplies | Pick and Place/Feeders
Feature : Hitachi Sanyo Universal UIC SMD SMT Component Feeder. Part Name: 8x2mm Paper Feeder with 7 Inch Reel Holder for 0402 0201 Chip. Part Number: CT-0885 . For Hitachi Sanyo TCM1000 TCM3000 Electronics Applied Systems Universal UIC HSP-479
Technical Library | 2023-05-02 19:16:57.0
1.5 with a 150μm specification window. For 0201 components, the minimum requirement is CpK > 2.0 with a 100μm specification window. The spec window may need to be reduced down to 75μm if the controls for high volume manufacturing are insufficient. Also directly impacting the placement quality is the ability to apply sufficient solder consistently to the board. The goal is to maintain current printing practices, but the effect of powder size will be examined. This paper will evaluate the impact of placement accuracy and solder powder size on 0201 manufacturing quality.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Management Experience: Over 5.5 Years Managing Production, Test, Warehouse, and Process Engneering, while improving overall Quality and Efficience Project Management Experience: Managed Various Cost Reduction projects using Lean Manu
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11739050-high-speed-surface-mount-placement-machine-fuji-scalable-placement-platform-nxt.html
High Speed Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅲ Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_pickandplace_philipsacm.html
Philips ACM Philips ACM Micro Placement Machine ID Number: M17570 Year 2000 Component Types: BGA, CSP, Flip Chips, Odds, Connector Optimal Run Rate
