Contract electronics design and manufacturing service provider. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection, and automated conformal coating.
Industry Directory | Consultant / Service Provider / Manufacturer
Full service provider of assembled and tested printed circuit boards both turnkey and kitted including development, design, and bare board layout. We assemble boards with 0201's to large scale IC's.
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Fri Feb 22 13:24:24 EST 2008 | mulder0990
How did I know senior was going to get in here too. Nice to see you again. I figured as much with the height difference, but I do not have the equipment here to test my thoughts. We somehow have our machine dialed in to run the 0201 parts with W
Used SMT Equipment | SMT Equipment
Product name: KE - 2020 - m JUKI chip mounter Product number: KE - 2020 - m Products in detail Suitable for small components of high-speed SMT placement machine The characteristics of As the single module module concept, can according to produ
Used SMT Equipment | SMT Equipment
Product name: KE2050M JUKI chip mounter Product number: KE2050M Products in detail SMT speed: 13200 CPH (laser identification) The laser head1 (4 nozzle) Patch area: 0603 (0201) inch chip ~ 20 mm square element, or 6.5 * 11 mm; 0402 (01005) in
Industry News | 2011-01-28 17:29:19.0
Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.
Industry News | 2003-02-18 09:39:06.0
Encourages You to Submit an Abstract for this Year's Conference
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Parts & Supplies | Pick and Place/Feeders
CL 8mm feeder for 0201 component (with green handle) if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
00367881S01 POWER SUPPLY FOR MONITOR 00368025-01 CRASH-PC-BOARD S-27 HM 00368075S02 Valve Drive, Placement Circuit, DLM2/DLM3 00368077S01 Star-drive digital DLM2 00368123S02 DISTRIBUTOR CAP PAS-LX-6 complete 00368211S02 DISTRIBUTOR CAP complete
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | Saginaw, Texas USA | Engineering,Maintenance,Management,Production,Quality Control,Technical Support
Over 20 Years Experience with SMT Processes at Large and Medium Sized Companies like Hitachi, Nokia, Siemens, and Variosystems Troubleshooting SMT Process Deficiencies and Recommending Short Term and Long Term Solutions. Developing Technical
SMTnet Express, April 16, 2020, Subscribers: 35,920, Companies: 10,989, Users: 25,757 Stencil Printing 008004/0201 Aperture Components Credits: ITW EAE This paper will focus on the application requirements of solder printing small aperture designs
KingFei SMT Tech | http://www.smtspare-parts.com/quality-13326671-juki-rs-1-smt-nozzle-7500-for-0201-smallest-components
JUKI RS-1 SMT Nozzle 7500 For 0201 Smallest Components Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2154.html
: TEST PCB 0201 TEST PCB 0201 PREVIOUS： 00368385-01 NEXT： 00368782-01 RELATED PRODUCTS CATEGORIES ABOUT US + SURFACE MOUNT SYSTEM + REFLOW FURNACE + OTHER PARTS + CONTACT US + CONTACT US Tel: 0086-512-86883013 Fax
