Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-dispenser.php
. Unlike a screen printer that is fixed in pad placement and volume, a dispenser can easily alter dispense location and volume based on adjusted program parameters
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30_post6316.html
: 7 Post Options Post Reply Quote jayx Report Post Thanks(1) Quote Reply Posted: 20 Apr 2015 at 3:54pm Hi Tom, OK, as advised I've downloaded Library Expert Lite and entered 1005 (EIA 0402) dimensions (based on Kemet: D=1±0.05, E=0.5±0.05, A=0.5±0.05. L/L1=0.3±0.1mm
