Industry Directory | Manufacturer
S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand
Industry Directory | Manufacturer
We are Malaysia Public Listed company subsidiary with capability in BGA, Reworking, Reballing, X-Ray, SMT, 0402 Chip, AI, ICT and F/A. We are ISO 9001 certified with RoHS Compliant and LMW status which is for free tax to service oversea customers.
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Assembly Services
introduction: ZH series is a fully automatic SMT placement machine, it can be mounted various of component through a vacuum nozzle, it is currently on the market cost-effective automatic placement equipment. The machine is suitable for most of the
Electronics Forum | Fri Oct 29 07:10:40 EDT 2010 | scottp
I agree with DucHoang. If your board and reflow profile have not changed then I would suspect incoming parts. We've seen tombstones when a chip supplier had plating problems.
Electronics Forum | Fri Apr 12 15:10:00 EDT 2002 | jsherrow
IMHO it's caused by three things: 1) placement 2) placement 3) placement
Used SMT Equipment | Chipshooters / Chip Mounters
SMT Pick and Place Universal [UIC] 4797 4797A-0-11002 12 Head Rotary Turret Tape & Reel Feeder Compatible 0402 Placement Capability
Used SMT Equipment | Chipshooters / Chip Mounters
2000 Fuji CP-643E SMT Pick & Place Approx Dimensions: 16'2" x 78" x 76" Location: Jasper, IN USA Serial: 1396 Features: o 4800 Vision Card o Narrow and Wide Camera o Capable of 0402 Component part placement o Pam Data Provided o Copy of Machine Prope
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Parts & Supplies | Pick and Place/Feeders
YAMAHA FS8*2MM FEEDER Feature : Yamaha SMT SMD Spares Part. Part Number: KJK-M1100-001. Part Name: FS Type Feeder 8x2mm. For 0402 Chip Brand : YAMAHA Unit : PC(s)
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-09-01 15:31:39.0
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.
Description MODEL ID: CM402-L MODEL NUMBER: KXF-4Z4C PCB DIMENSIONS: L 50 mm x W 50mm to L 510 mm Ã? W 460 mm HEAD TYPE: Type A-2 (12/12 nozzles HIGH-SPEED) (OPTION) Number of nozzles: 12 nozzles/head Maximum speed: 0.052 s/chip (69,500
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
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