Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
Electronics Forum | Thu Nov 13 09:14:52 EST 2008 | raiders
Hi All, We encounter capacitor crack in the ICT, it contributes 2% of the failure. We are not sure whether these crack coming from the SMT. All these crack having the same pattern. Please refer to attached file. Anybody encounter the same thing befo
Electronics Forum | Thu Nov 13 13:07:04 EST 2008 | vladig
Yes, it does look like a typical crack due to mechanical overloading (bending) of teh component. Usually because of the board flexing Vlad
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Parts & Supplies | General Purpose Equipment
CC41 / CT41 SMD Multilayer Ceramic capacitor HV MLCC, Chip Ceramic capacitor, SMD Ceramic capacitor,Samsung SMD MLCC, high voltage MLCC, 155C / 175C / 200C high temperature MLCC Characteristics: Operating Temperature Range: -55C to 200C Rated Vol
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ZK Electronic Technology Co., Limited E-mail : sale@hysmt.cn Skype: 14786692449 WhatsAPP:14786692449 Tel: +86-0755-27801389 Website: www.fhysmt.com www.smt-cn.com www.fhysmt-connie.com
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
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Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
