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PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Tue Jun 24 12:56:26 EDT 2014 | jmathis
Hello, As our company has begun doing an increase production of contract manufacturing I have seen more and more designs with the 0402 pad layouts that are smaller (.015 in width) than the component. Also there is only a .008 longer than the 0402 p
Electronics Forum | Fri Jan 06 05:03:11 EST 2012 | richieoreilly
Hi All, Just wondering if anyone is placing 0201 components in volume. If so What pad layout are you using, i.e. pad size, shape and spacing. Also are you pads and fiducials solder mask defined or copper defined. Can you also let me know the rough q
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIIC Details:1.High-Speed Mounting Capability: The FUJI XPF-L mounting machine boasts a mounting speed of up to 25,000 CPH .2.Automatic Head Changer: It features the world's first automatic head changer technology, allowin
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Parts & Supplies | Pick and Place/Feeders
AMAHA YV100II pcb assembly machine Alingment tool T KM1-M8830-00X KH4-M668R-00X HARNESS LIMIT SWITCH K46-M8527-C0X FILTER K46-M8527-00X FILTER KG7-M7137-A0X LEAF SPRING $KM-05 MUFFLER SKM-05 MUFFLER KV8-M71Y9-00X BODY CYLINDER YAMAHA YV100X KM
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Parts & Supplies | Pick and Place/Feeders
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40001424 FEEDER COVER R (EN) 40001590 BASE FEEDER POWER BOARD PANEL ASM 40001941 BASE FEEDER PCB ASM. 40002070 +YL LMT
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
See what some of our customers have to say about the complete PCB design environment offered by PADS 9.0. This next generation in PCB Design tool combines an intuitive, flexible design environment with integrated, scalable technology. Giving engine
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Newport Beach, California USA | Engineering,Management,Production
KEVIN RAGER P.O.BOX 7878, NEWPORT BEACH, 949 922 8997, KEVIN.RAGER@EDA-INC.US OBJECTIVE I am trying to find a consistent work flow that provides mentally challenging yet stimulating experiences in design and prototype development. EXPERIENCE 1997
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Layout 1 800-643-7822 eptac.com eptaccanada.ca Download the App at eptacapp.com TRAINING ■ Expert Training in the Latest Technologies
Imagineering, Inc. | https://www.pcbnet.com/blog/considerations-for-pcb-board-design-layout/
Considerations for PCB Board Design & Layout | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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