Industry Directory | Distributor
Founded in 1988 in Rochester, NY, Saelig is a North American distributor with a growing reputation for finding and sourcing unique, easy-to-use control and instrumentation products.
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno
Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only
Industry News | 2021-03-04 13:48:24.0
AMFAS Metal Casting Processes include Die Casting, Investment Casting and Sand Casting Capabilities
Industry News | 2011-04-22 21:33:34.0
Statistics indicate that China's electronics and information manufacturing industries in 2011 show a good start with steady growth. Its added value grew by 14.3 percent in the first two months, 0.2 percent higher than China’s industrial average, and accomplished a sales value of RMB970.6 billion Yuan, a year-on-year rise of 21.6 percent.
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
| https://www.eptac.com/instructors/
+ Advanced Designer Certification Chairman of IPC-2221/2222 Designer Subcommittee Chairman of IPC-2226 HDI Design Subcommittee Co-chairman of IPC-7351 Land Pattern Subcommittee Previous Chairman of IPC
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Yi Abstract 2016 29-3 Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package M. Neilsen and P. Vianco Abstract 29-3 Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors