Industry Directory | Manufacturer
S.B.TECHNOLOGIES provides Electronics Manufacturing Services with 0402 CHIP SMT Assembly,BGA, Thru-Hole PCB Assembly, Wave Soldering, Reflow Soldering, Mixed Technology Printed Circuit Board Assembly build to IPC-Workmanship Stand
AUTOTRONIK-SMT is a German company provides High Precision SMT Pick & Place Machine, Stencil Printer,Reflow Oven. which are low-cost, high accuracy ,with Laser & Vision alignment, can handle 0201,0402,SOIC,PLCC,Micro-BGA,0.3mm QFP,..etc.
YAMAHA YG200 is a high-speed SMD Surface Mounting machine, which has 4nos tables and totals 24 head nozzles, this machine mainly used for mount chip components, like 0201/0402/0603/0805/1206 or small QFN IC. “DONGGUAN KINGSUN AUTOMATION TECHNOLOGY
JUKI KE2070L High Speed Chip Shooter SMT Machine MC Model KE-2070 Board size M size (330×250mm) ○ L size (410×360mm) ○ L-Wide size(510×
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Used SMT Equipment | Chipshooters / Chip Mounters
Specifiaction: Model YSM10 YS12 YS24 Applicable PCB L 510 x W 460mm - L 50 x W 50mm L510x~W460mm to L50x~W50mm L50mm x W50mm to L700mm x W460mm Mounting Capability 46,000CPH 36,000CPH 72,000CPH Mounting Accuracy ±0.035 mm
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
YAMAHA YG200 is a high-speed SMD Surface Mounting machine, which has 4nos tables and totals 24 head nozzles, this machine mainly used for mount chip components, like 0201/0402/0603/0805/1206 or small QFN IC. “DONGGUAN KINGSUN AUTOMATION TECHNOLOGY
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Fremont, California USA | Production
Able to perform operation from set-up, inspection, minor troubleshooting on Juki/Panasonic pick & place machines. Able to perform operation of MPM/Dek printers, Victronics reflow ovens that are utilized in production. Able to perform routine
Career Center | Bangalore, Karnataka India | Engineering,Production,Research and Development,Technical Support
� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company
| https://www.feedersupplier.com/sale-13067454-asm-00141099-siemens-s-3x8mm-0201-0402-smt-feeder.html
ASM 00141099 Siemens S 3x8mm 0201 0402 Smt Feeder Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/0402-min-size-land-pattern_topic30&OB=DESC_page2.html
“Nominal” environment for library construction, use the “Least” environment for the 0402 (1005) land pattern. Too much solder on this micro-miniature 2-pin component causes tombstoning in the assembly reflow oven
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