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Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
Parts & Supplies | Pick and Place/Feeders
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| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
(correct solder pad size and land pattern) for the same component listed in the Bill of Materials (BOM). The mismatch of component footprint spacing is usually an error created when components on the PCB assembly ( PCBA