SMT SAMSUNG Feeder NA118201 CP45 FV0603 2MM Feeder for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm F
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
Electronics Forum | Fri Nov 27 08:58:39 EST 1998 | Des
I have a PCMCIA type pcb with an 0603 resistor situated exactly half way along the longest edge the device is 2mm form the edge of the pcb. I have experienced incidences of the device fracturing after breakout (hand operation) (pcbs are routed) Coul
Electronics Forum | Tue Dec 01 10:19:43 EST 1998 | Dave F
| I have a PCMCIA type pcb with an 0603 resistor situated exactly half way along the longest edge the device is 2mm form the edge of the pcb. I have experienced incidences of the device fracturing after breakout (hand operation) (pcbs are routed) Co
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2014-04-08 13:08:59.0
IMS announced today that the A-0402WA attenuator is now available taped face-down in the pocket. The part number for this orientation is IMS2652. This taping arrangement has previously been available for the A-0603 (IMS2533) and A-0805 (IMS1141) sizes. Now all three of the most popular sizes of the A-Series are available in both face up and face down arrangements.
Parts & Supplies | Pick and Place/Feeders
SMT SAMSUNG Feeder CP45 FV0603 Feeder for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER
Parts & Supplies | Pick and Place/Feeders
SMT SAMSUNG Feeder CP45 FV0603 Feeder for pick and place machine Samsung SM/CP40 CP45 Feeders models: SAMSUNG SM 8*2mm FEEDER SAMSUNG SM 8*4mm FEEDER SAMSUNG SM 12mm FEEDER SAMSUNG SM 16mm FEEDER SAMSUNG SM 24mm FEEDER SAMSUNG SM 32mm FEEDER
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
Led bulbs production line in India 2019 July newly installed contact : skype id : peter.huang187 , Mobile : 0086-13610497541 email : leadsmtmachines@163.com
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
| http://etasmt.com:9060/cc?ID=te_news_media,23161&url=_print
+-0.05mm Positioning method MARK point camera +flying camera Component range 0603 upper resistor and capacitor, and all kinds LED 3528,5050 LED chips, meanwhile meet Can mount components requirement of SOP SOT chip placement, and compatible with all kinds of high-power chip mount
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1293.00 270 S0603T_TOP RESISTOR: 53.6 OHM 1% 0603 R165 347-000080-332 3166.00 2688.00 270 S0402T_TOP RESISTOR: 33.2 OHM 1% 0402 MIRTEC AOI: [Fiducial] Fid1_X= 0 Fid1_Y= 0 Fid2_X= 0 Fid2_Y= 0 [Part Info] Coordinate Transform
