Industry Directory | Distributor
Ditributor for Solder Products of Indium Corporation of America. Solder Paste, Pb and Pb free, Flux, Solder Wire, Solder bar, Preforms,Thermal Interface and Solar material and,Engineering solders etc
Industry Directory | Manufacturer
manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Tue Oct 14 15:32:33 EDT 2008 | gregcr
Hi all, Looking for a solder preform supplier. Looking to use small solder washers on a project and looking for a supplier. If anyone has suggestions please let me know. thanks
Electronics Forum | Tue Oct 14 17:04:30 EDT 2008 | waveroom
Aim solder out of Rhode Island, contact your local Aim Distributor. Very affordable. http://www.aimsolder.com
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Glue Dispenser Nozzle Part Number: KV6-M711A-0XX Model: 0603 Component: 1608mm Material: Metal Machine Model: YV64D YV64D glue dispenser nozzle 0603 KV6-M711A-0XX SHOT 1608(P0.8) NOZZLE 2 SHOT1608(P0.8) 1 T
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Glue Dispenser Nozzle Part Number: KV6-M711A-0XX Model: 0603 Component: 1608mm Material: Metal Machine Model: YV64D YV64D glue dispenser nozzle 0603 KV6-M711A-0XX SHOT 1608(P0.8) NOZZLE 2 SHOT1608(P0.8) 1 T
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
ETA LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Pick and place machine, SMT pick and place machine, SMT mac
FUJI SMT Placement AIMEX III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, FUJI SMT m
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | South Plainfield, New Jersey USA | Management,Sales/Marketing
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | Gurgaon, Haryana India | Management
� Heading daily morning meeting with all program managers, materials manager, test engineering manager, process engineering manager, quality control manager, planning manager, stock room manager, shipping department head. Discussion about incoming or
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9398251-yv64d-glue-dispenser-smt-nozzle-0603-kv6-m711a-0xx-shot-1608-p-0-8-nozzle-assembly.html
: KV6-M711A-0XX Model: 0603 Component: 1608mm Machine: YV64D Type: 111 YMH (YV64D/YV100D) PICK UP NOZZLE 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
