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YAMAHA CL84 Feeder Yamaha FEEDER CL8X4 with extesion reel holder P/N: KW1-M1200-00X, P/N: KW1-M1100-000, NEW The depth of groove for the material is 2.5mm. 4mm Pitch (Sprocket), Tape guide 8X4 (0603,0805) Sales: Becky Su MP:86-15323874439 Email:
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YAMAHA NOZZLE SERIES Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA YV100II 32#NOZZLE For IC of tiny size Tungst
Electronics Forum | Wed Feb 29 06:33:49 EST 2012 | amitsindwani
Please define the defect in following conditions & link to IPC 610 clause/sub-clause no.: 1. 0603 component placed on 0805 PCB pad 2. 0805 component placed on 0603 PCB pad 3. 1206 component placed on 1210 PCB pad and 4. 1210 component placed on 1206
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification ： DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | Pick and Place/Feeders
CM88S-M 1. Theoretical speed: 0.085 seconds/point 2. Feeder configuration: 30 pieces 3. Equipment year: 2003 4. Available patch range: 0201,0402; 0603; 0805; 1206; MELF diode; Transistor, 32mQFP, SOP, SOJ, LED: 3528, 3014, 50, 5730. 5. Patch a
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Parts & Supplies | SMT Equipment
MPA G3 Model: PANASERT MPA G3 Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805 Tungsten steel
Parts & Supplies | SMT Equipment
MPA 40 80 Model: PANASERT 40 80 Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805 Tungsten steel
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
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YAMAHA YS12F Flexible SMD SMT Pick And Place Machine For 0402 0603 0805 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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