The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
http://www.flason-smt.com/product/Yamaha-YV100II-31A-Nozzle-0805.html Yamaha YV100II 31A Nozzle 0805 SMT Nozzle Yamaha Nozzle Yamaha YV100II 31A Nozzle 0805 Usage:Yamaha pick and place machine Product description: Yamaha YV100II 31A Nozzle 08
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision
Industry News | 2010-06-16 14:00:47.0
Minneapolis, MN - The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010. This year's program allows the attendee to choose from 20 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
Industry News | 2020-01-20 16:42:42.0
The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37303994-kxf07quaa00-pad-for-cm402-cm602-1004-nozzle-cm-mtnp002974aa.html
KXF07QUAA00 SMT Spare Parts Pad For CM402 CM602 1004 Nozzle CM MTNP002974AA Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://unisoft-cim.com/xyr-sample-files.html
",35.80,41.00,0,bottom FID2,"fiducial-50-round","fiducial",14.50,49.00,0,bottom R16,"0805","10K",34.50,50.15,180,bottom C63,"0603","0.1uF",17.25,55.67,90,bottom C45,"0603","0.1uF
