New Equipment | Tape and Reel Services
We carry an entire line of vacuum vick-up caps for interconnect. Plastic or metal, low minimums, no volume limitation. All types, head-caps, 1.0, 1,27, 2,0, 2.54mm, widest selection on the planet. Visit www.npimaterials.com for details.
Machine details: Back device table doors installed. New Type of Nozzle Holder Shaft Assembly. Machine Software Version: V1.27 Machine Vision Software Version: V3.00 Machine Mfg Date: NOV. 1999 Machine Working Hours: 15,024 Type/Quantity of noz
Electronics Forum | Mon Apr 04 22:07:15 EDT 2005 | Dhanish
Questions and answers - what Column pitch do your CCGA have ? a) 1,27 mm?b) 1.00 mm? 1.27mm - how are the PCB pad finisched ? OSP Enig? HAL? OSP - Are you using Clean or NC solder paste? Clean
Electronics Forum | Tue May 04 13:32:05 EDT 2004 | tigerlordgm
What lead pitch, .8mm or 1.27mm?
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Used SMT Equipment | Pick and Place/Feeders
Japan YAMAHA YV100-XTG placement machine: Patch speed: 0.135 seconds/CHIP SMD PCB size: L330XW250MM_L50XW50MM SMD components:0603(MM)-31MMX31MM components SOP SOJ PLCC SMD components can put 100 kinds (8MM) Mounter size: L1650XW1408X1
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Parts & Supplies | SMT Equipment
YV100II Head SHAFT, HEAD ASSY KM8-M712S-A00 1 KM8-M7101-20X HOUSING,HEAD 1 2 KM8-M7103-A0X PLUG 1, ASSY 8 3 KM8-M7103-00X PLUG 1 1 4 KM1-M7140-00X PACKING 1 5 K65-M257M-00X O-RING 1 6 KM1-M7104-A0X PISTON, ASSY 8 7 KM1-M7104-00X PISTON 1 8 KM
Parts & Supplies | SMT Equipment
YV100II Head SHAFT, HEAD ASSY KM8-M712S-A00 1 KM8-M7101-20X HOUSING,HEAD 1 2 KM8-M7103-A0X PLUG 1, ASSY 8 3 KM8-M7103-00X PLUG 1 1 4 KM1-M7140-00X PACKING 1 5 K65-M257M-00X O-RING 1 6 KM1-M7104-A0X PISTON, ASSY 8 7 KM1-M7104-00X PISTON
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an
TI New and Original LM34DZ/NOPB in Stock IC TO-92-3 22+ package LM34DZ/NOPB ±1°F 5V to 30V Analog Output Temperature Sensor with Fahrenheit Scale FX2-32P-1.27SVL(71) CONN HRS 21+ TPS92520QDADRQ1 HTSSOP32 TI 19+ LTC4364IDE-2 DFN-14 LT 21+ 43
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-dsseries-specs.php
*Based on speed test of 1,000 dot pattern at 0.050” (1,27 mm) spacing with certain SMT adhesive materials, at 0.020” (0,508 mm) dot diameter. **With System Mapping over complete system work area
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