Industry Directory | Manufacturer
We can provide you all types of PCBs, including rigid (1~30layers), flex (1~6layers) and rigid-flex circuits (1~6layers) no m
6SE7016-1EA61 6SE7018-0EA61 6SE7021-0EA61 6SE7021-3EB61 6SE7021-8EB61 6SE7022-6EC61 6SE7023-4EC61 6SE7023-8ED61 6SE7024-7ED61 6SE7026-0ED61 6SE7027-2ED61 6SE7016-1TA61 6SE7018-0TA61 6SE7021-0TA61 6SE7021-3TB61 6SE7021-8TB61 6SE7022-6TC61 6SE7023-4TC6
Rogers Material 1.6mm Thickness 2 Layers 1oz copper thickness Gold Plating Surface Treatment red Solder Mask e-test
Electronics Forum | Mon Feb 27 23:11:44 EST 2012 | ev
Can you give me some more info I think I might be able to help. Are these boot disks that come with the machine and is it 1.6 version? Ev
Electronics Forum | Fri Feb 15 11:18:08 EST 2013 | richardc
Does anyone know the mechanical differences between a TPsys 1.6 version feeder and a 1.4. I only need to have one feeder for the 1.4 machine and would modify a 1.6 feeder if that is an option. Otherwise, does antone have a 1.4 version feeder they w
Used SMT Equipment | Pick and Place/Feeders
2006 Siemens HF SMT Pick & Place Cycles: 29,971,511 Note: The following items are included with this machine: (3) Feeder Carts (1) MTC 2 (1) 6 Segment Placement Head Serial: A368-12031214 Item Location: Guadalajara, Mexico
Used SMT Equipment | Pick and Place/Feeders
Make: Mydata Model: TP9-2U S/W: Version 1.6.10 Description: SMT Pick & Place Machine Condition: Operational Location: TX, USA
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Parts & Supplies | SMT Equipment
PA Reflecting Part Name：1#反光板(白色) PART No：102241013104 Part Name：5#反光板(白色) PART No：102241013502 Part Name：反光板(橙色) D=1.6 PART No：102246572101 Part Name：反光板(橙色) D=8.0 PART No：102246575101 Part Name：2#反光板(白色) PART No：102241013202
Parts & Supplies | SMT Equipment
PA Reflecting Part Name：1#反光板(白色) PART No：102241013104 Part Name：5#反光板(白色) PART No：102241013502 Part Name：反光板(橙色) D=1.6 PART No：102246572101 Part Name：反光板(橙色) D=8.0 PART No：102246575101 Part Name：2#反光板(白色) PART
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
03027548-01 Guide, left-hand side 03027563-01 Loctite 7063 CLEANER 03027570-03 HOTLINK CARD CPCI A14 K-01 03027644-01 HOLDER FOR CABLE INTERFACE 03027646-02 JUMPER 120 Ohm SUD-D PIN 03027905-01 Adapter cable MTC2 CAN bus 03028249-02 Pneumatic S
40001096 CENTERING PIN 2.5 40001097 CENTERING PIN 2.0 40001098 CENTERING PIN 1.9 40001099 CENTERING PIN 1.8 40001109 MNLA HEAD ASM. 40001110 MNLA HEAD BRACKET AS 40001113 T PULLEY 1 40001114 T PULLEY 2 E86887000A0 LED PS PWB ASM E8688700
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | ,
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Events Calendar | Tue Nov 09 00:00:00 EST 2021 - Tue Nov 09 00:00:00 EST 2021 | Chelmsford, Massachusetts USA
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Career Center | Hyderbad, India | Engineering
i do not have any experiwnce.iam passedout b.tech in the strem of e.c.e in the year 2017.iam very intersted like passion to do job on electronics i liked sooo much that type of job.i will search about that job in seceredarbad.iam aslo stydying m.tech
Career Center | madak, AP India | Engineering,Research and Development,Technical Support
i have zero experience.
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/233.html
* 1,6 VITON 80 O-RING 6,5 * 1,6 VITON 80 PREVIOUS： 00308443-05 NEXT： 00308458-01 RELATED PRODUCTS CATEGORIES ABOUT US + SURFACE MOUNT SYSTEM + REFLOW FURNACE + OTHER PARTS + CONTACT US + CONTACT US Tel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/products/dispense-tips/metal-nozzles
" 7014850 1 8 3,4 mm 0,135" 7014851 1 10 2,7 mm 0,106" 7014848 1 12 2,2 mm 0,085" 7014842 1 14 1,6 mm 0,063" 7014844 1 16 1,2 mm 0,047" 7014846 1 Ebben a részben Terméktípus Adagolóhegyek Hajlított adagolóhegyek Csalétekadagoló
