Industry Directory | Manufacturer
Hermetic Power Package, Hermetic fiber optic package, Sensor Header, Hermetic IC Hyrbid packge, TO Header
New Equipment | Assembly Services
Heavy Copper Printed Circuits supplier Saturn Electronics Corp., bare printed circuit board manufacturer, was one of North America's largest users of heavy copper PCB laminate, which we used in the bare PCB manufacturing of Power Distribution Boards
sales5_at_etlimited_cn PCB assembly service, PCB assemblies,PCBA Contract, Printed circuit boards assembly. China 8 layers PCB&PCBA supplier and exporter,8 layers PCBA with SMT,BGA and electronical components. This PCBA's key s
Electronics Forum | Fri Oct 03 05:27:24 EDT 2003 | kanwal324
the puspose of solder mask is to prevent exposure of cu tracks to atmosphere. the lesser thickness can effect the performance of board but it only depends on its application. if you are making telecom board then its not good to use the board.
Electronics Forum | Sat Dec 10 07:03:59 EST 2005 | mdemos1
Hi. I am trying to find out the minimum copper thickness I should see on a through hole barrel. The board has 1 ounce copper and the board thickness is 0.062". I am finding thicknesses of 0.6 to 1.2 mils. Thanks, Mike.
Used SMT Equipment | Semiconductor & Solar
Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Pick and Place/Feeders
KXFB02QQB01 BRACKET 0 KXFB0210A00 PIN 0 KXFB04W5A00 BRACKET 0 KXFX03EHA00 PRESSURE-SW ISE30-01-25-M-X114 N510066819AA JOINT KQ2N04-M5A KXF0DR2AA00 JOINT GWS6-8 N210022436AB COVER 0 N210035700AA HOLDER 0 KXFB04UJA00 GUIDE 0 KXFB0AQ7A00 STOPPE
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Parts & Supplies | Component Packaging
KME CM402 Pressure Sensor PSE541-01-X106 (SMC) N610027221AA Panasonic KME CM212-M(NM-EJM6A) Modular Placement Machine N510020101AA WASHER Thick washer for M6 Panasonic KME CM212-M(NM-EJM6A) Modular Placement Machine N210023716AA BAR Panasonic
Technical Library | 2019-06-20 00:09:49.0
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to develop at the Cu6Sn5/Cu interface and an imbalance in the diffusion of atomic species, Sn and Cu, across that interface results in the formation at the Cu3Sn/Cu interface of Kirkendall voids, which can also compromise reliability in impact loading. However, when, as is the case in some microelectronics, the copper substrate is thin in relation to the volume of solder in the joint an overriding concern is that all of the Cu will be consumed by reaction with Sn to form these intermetallics.This paper reports an investigation into the kinetics of the growth of the interfacial intermetallic, and the consequent reduction in the thickness of the Cu substrate in solder joints made with three alloys, Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni and Sn-1.5Bi-0.7Cu-0.05Ni.
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
Improve wetting with flux, alloy choice, and/or increase temp Ensure PTH components can survive increased temp Increased thermal stress on PTHs Reduce z-axis CTE and/or increase Cu thickness. 1–3 additional processor sockets are required per board
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
