New SMT Equipment: 1.5mils (3)

Masking dots tape

Masking dots tape

New Equipment | Materials

Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃. Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer

SHENZHEN KHJ TECHNOLOGY CO.,LTD

Dry Film Solder Mask

Dry Film Solder Mask

New Equipment | Solder Paste Stencils

Dry Film Solder Application SolderMask, Inc. continues to apply Dry Film Solder Mask (DFSM) on Printed Circuit Boards (PCB) since opening for business in 1985. SolderMask, Inc. works with all DFSM available in the United States. Some of the DFSM ma

SolderMask Inc.

Electronics Forum: 1.5mils (14)

Re: 1 mil or 25 um trace width

Electronics Forum | Thu Apr 29 10:11:41 EDT 1999 | Cunli

| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. | Dan, I have seen boards with 3 mil pitch (that is 1.5 mil trace and 1.5 mil spacing) in quantity

0402 aperture design lf

Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc

Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.

Used SMT Equipment: 1.5mils (1)

ASM Siemens MS899

ASM Siemens MS899

Used SMT Equipment | General Purpose Equipment

ASM MS899-DL Wafer Mapping Die Sorter Machine is in like new condition! Serial Number: MS899DL-01817-0402 Model Number: MS899-DL Year 2008 August Cycle Time: 175 ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3 degrees Collect type: Surfa

1st Place Machinery Inc.

Industry News: 1.5mils (3)

High Quality SMT Stencils + Free Technical Assistance

Industry News | 2015-12-10 17:59:21.0

Metal Etch Services has more than 25 years experience manufacturing High Quality SMT Stencils, based on this experience we offer free technical assistance to all our customers.

Metal Etch Services, Inc.

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Express Newsletter: 1.5mils (3)


1.5mils searches for Companies, Equipment, Machines, Suppliers & Information

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