Industry Directory | Manufacturer
We can provide you all types of PCBs, including rigid (1~30layers), flex (1~6layers) and rigid-flex circuits (1~6layers) no m
DEK Horizon 02i Automatic Screen Printer Dek Horizon Repeatability: 1.6 Cpk @ 25µm Cycle time: As fast as 10 seconds Setup time less than 10 minutes Changeover time: less than 2 minutes Optimised Printer Frame common to all Horizon machines Accept
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
Used SMT Equipment | Pick and Place/Feeders
Make: Mydata Model: TP9-2U S/W: Version 1.6.10 Description: SMT Pick & Place Machine Condition: Operational Location: TX, USA
Used SMT Equipment | Pick and Place/Feeders
2006 Siemens HF SMT Pick & Place Cycles: 29,971,511 Note: The following items are included with this machine: (3) Feeder Carts (1) MTC 2 (1) 6 Segment Placement Head Serial: A368-12031214 Item Location: Guadalajara, Mexico
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Industry News | 2003-02-13 07:53:53.0
Belgian Laminate Plant Set to Come Online
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
40001096 CENTERING PIN 2.5 40001097 CENTERING PIN 2.0 40001098 CENTERING PIN 1.9 40001099 CENTERING PIN 1.8 40001109 MNLA HEAD ASM. 40001110 MNLA HEAD BRACKET AS 40001113 T PULLEY 1 40001114 T PULLEY 2 E86887000A0 LED PS PWB ASM E8688700
03027548-01 Guide, left-hand side 03027563-01 Loctite 7063 CLEANER 03027570-03 HOTLINK CARD CPCI A14 K-01 03027644-01 HOLDER FOR CABLE INTERFACE 03027646-02 JUMPER 120 Ohm SUD-D PIN 03027905-01 Adapter cable MTC2 CAN bus 03028249-02 Pneumatic S
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Nov 08 18:30:00 UTC 2021 - Mon Nov 08 18:30:00 UTC 2021 | ,
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Events Calendar | Mon Nov 08 18:30:00 UTC 2021 - Mon Nov 08 18:30:00 UTC 2021 | Chelmsford, Massachusetts USA
Boston Chapter Hybrid Meeting: OSAAP Shadowboard & Inlay Design Process for LEAN & 5S Applications
Career Center | Madurai, India | Engineering,Production
I have 1.6 years of experience in SMT as team leader I have manage 40 member in our company we production team leaders must check the loading materials first then the quality team will check.. And I have a knowledge in Quality too..
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
Heller Industries Inc. | https://hellerindustries.com/parts/7369k/
7369K - PROBE T/C, 1.6 mm DIA, Single Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37303915-panasonic-msh3-nozzle-0402-0805-0603-1-6-2-2-2-5.html
Panasonic MSH3 Nozzle 0402 0805 0603 1.6 2.2 2.5 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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