Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
Ludee Circuits offer RoHS PCB.We could offer leadfree HASL,Entek, flash gold, immersion gold, immersion silver, immersion tin finishing based on standard FR-4, CEM-3 materials, Teflon, Rogers RO4000 series, as well as high Tg S1170 materials.
Automatic V-Groove PCB Cutting Machine HMF505 Feature 1. The microcontroller control the blade, operation is simple and convenient. 2. Infrared light curtain induction and protection tool double protection, safe production. 3. The blades use high qu
Automatic V-Groove PCB Cutting Machine HMF505 Features 1. The microcontroller control the blade, operation is simple and convenient. 2. Infrared light curtain induction and protection tool double protection, safe production. 3. The blades use high
Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol
Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type
Electronics Forum | Thu Nov 13 20:48:04 EST 2003 | davef
There a number of studies like this published by component fabricators. Many can be found on the net. For instance: http://www.amd.com/us-en/assets/content_type/DownloadableAssets/Pb-free_Board-level_reliability_study.pdf
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
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Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Ruichi Standard Soldering Robot R351. Soldering Tip can be designed according to your products.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
°C above SnPb or SnAgCu solder liquidus temperatures. Four different sizes of pure tin plated chip resistors, 1206, 0805, 0603, and 0402 were used in this experiment
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
. Drilling differs depending on the type of via being used , but generally is done on a stack of 2-3 panels at a time. The end result will generally be 5 mil larger than the end product, as these holes will be plated with copper to help send electrical signals through a process called electroless copper deposition
