Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Used SMT Equipment | X-Ray Inspection
Make: GE Model: Pcba ! Inspector 100 Vintage: 2001 Description: X-Ray System Condition: Complete & Fully Operational Video Link: https://www.dropbox.com/sh/fjlezf9qjfciszo/AACWw8hheYZYMg1mo-1tllkSa?dl=0 Location: Texas Availability: Immediate
Used SMT Equipment | Pick and Place/Feeders
2012 Mydata My100LXe-10 Pick and Place Make: Mydata Model: MY100LXe-10 Vintage: 2012 Description: SMT Pick & Place Software: 5.1.1a Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay Pleas
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Jun 02 18:30:00 UTC 2024 - Sun Jun 02 18:30:00 UTC 2024 | St. Paul, Minnesota USA
Upper Midwest Event: District Energy and Landmark Tour Downtown St. Paul
Events Calendar | Sun Jul 07 18:30:00 UTC 2024 - Sun Jul 07 18:30:00 UTC 2024 | ,
Heartland Chapter Technical Webinar: Virtual STAR Forum
Career Center | , Texas USA | Engineering,Management,Production,Purchasing,Quality Control
TEXAS JOBS � Must hire by January! Global Company New Contract! Tier 1 EMS (before Flex declared they are the only Tier 1) HR CALLED US! HELP! HIRE TODAY! Quality Engineers 55-70k Supplier Quality Engineer Logistics Specialist 50-60k(looki
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSEE MS preferred, MMW (30 to 100 GHZ) Design using MIMIC chips) need knowledge of radar systems or FMCW CAE/CAD tools (Ansoft, EEsoft, spice) HP 8510 Test equipment. Knowledge of spectrum analyzers, oscillosopes is a necessity.
Career Center | , Hungary | Maintenance
QP-242 Level 1 Fuji CP-642 Level 1, 2 Fuji CP-643 Level 1. 2 Fuji F4G operating and programming FujiCam Programming Level 1 DEK Maitenance and Troubleshooting Fuji Flexa Progarmer Level 2 BTU Paragon 150 Oven IP3 level 1
Career Center | Paco, Manila, Philippines | Engineering,Maintenance,Production,Technical Support
Operation, Programming & Troubleshooting of following machines: Fuji Machine GP641E, CP642, CP6, CP643E, IPIII, QP242E, QP341E MM using F4g, Fujicam and Fujiflexa Software. YVL88II,YV88X, YV100II,YV100XG,YG200XG ( Chip shooter & IC Placer) by Y
KingFei SMT Tech | https://www.smtspare-parts.com/sale-27186116-juki-jx-100-jx-100led-conveyor-belt-40086822-40095011.html
JUKI JX-100 / JX-100 LED Conveyor Belt 40086822 40095011 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/adhesive-dispensing-systems/products/applicators/em-100-series-electric-guns
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