eavy copper board Material FR-4 Layers : 2 Trace width/space : 10 mil/10 mil Copper thickness 5/5 oz Application : High Voltage power Supply
New Equipment | Fabrication Services
Minimum line width/space: 5mils Surface finish: OSP Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Electronics Forum | Sun Nov 12 21:28:09 EST 2000 | Rchard Eigner
We are manufacturing a PCB that uses an integrated circuit that has a leg spacing of 10 mils, other components on the PCB are 1206's and 0805's. Is it possible to make the stencil apertures 10 mils apart or is there another way of making the stencil.
Electronics Forum | Mon May 10 17:18:27 EDT 2010 | hegemon
Could you be looking for an endoscope with a 10 mil O.D? Not aware of anything that small. Am I reading you correctly? You are trying to peer into a 5 or 10 mil opening to see what's happenning inside of something? 'hege
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel. pec beam 2 firewire
Used SMT Equipment | Pick and Place/Feeders
Serial: 10101112 Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Parts & Supplies | Soldering Equipment/Fluxes
Two-Piece Fine Pitch RocHard 10 MilProbe Kit
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
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