Industry Directory | Manufacturer
Design and Manufacture Desiccant Dry Cabinets for low humidity storage and baking of moisture sensitive components, PCBs, electronic materials, lab samples, digital media and medical devices.
Industry Directory | Distributor / Manufacturer
Electronic Manufactoring Services specialised on transparent conductive Films and on a cold pick & place process.
ABB DSTX180 3BUR980025R1 [Product Details] Brand/Manufacturer：ABB Country of origin：SWEDEN Worldwide shipping: DHL, UPS, Fedex, and TNT Warranty: 1 year [Contact Me] Sales Manager：Jim Mobile(WhatsApp): 86-18020776782 Emai
ABB PMA324BE [Product Details] Brand/Manufacturer：ABB Country of origin：SWEDEN Worldwide shipping: DHL, UPS, Fedex, and TNT Warranty: 1 year [Contact Me] Sales Manager：Jim Mobile(WhatsApp): 86-18020776782 Email: sales6@am
Used SMT Equipment | In-Circuit Testers
Fast Ramp ESS temperature chamber: Perfoms 5C to 25C per minute +125C to -20C based on 400lbs of aluminum and 1500 watts live load. Can be modified to perform -40C. Interior Dimensions: 2.14M X 2.14M X 2.14M / 7 feet X 7 feet X 7 feet. Elect
Industry News | 2021-05-21 14:09:53.0
Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications
Industry News | 2021-01-05 10:40:44.0
Automotive Grade Aluminum Electrolytic Capacitors Increase Design Flexibility and Save Board Space in High Temp Applications
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Logic - Gates, and Inverters Features: High noise immunity Low power dissipation SOT353-1 and SOT753 package options ESD protection: HBM JESD22-A114E: exceeds 2000 V MM JESD22-A115-A: exceeds 200 V CDM JESD22-C101C: exceeds 1000 V Specified from?40°C
Buffers & Line Drivers Logic - Buffers, Drivers, Receivers, Transceivers Buffer, Non-Inverting 2 Element 1 Bit per Element Open-Drain Output 6-TSSOP
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each component
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